Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Livramento, V.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (8/8 displayed)

  • 2013Multiscale copper-μdiamond nanostructured compositescitations
  • 2012Tungsten-nanodiamond composite powders produced by ball milling13citations
  • 2011Tungsten-microdiamond composites for plasma facing components10citations
  • 2011Copper-micrometer-sized diamond nanostructured composites3citations
  • 2010Consolidation of Cu-nDiamond nanocomposites12citations
  • 2009W-diamond/Cu-diamond nanostructured composites for fusion devicescitations
  • 2008Novel approach to plasma facing materials in nuclear fusion reactors1citations
  • 2007Plasma-erosion of Cu-nanoDiamond and W-nanoDiamond compositescitations

Places of action

Chart of shared publication
Carvalho, P. A.
7 / 25 shared
Liberal Fernandes, Hugo
6 / 8 shared
Shohoji, N.
7 / 8 shared
Nunes, Daniela
8 / 39 shared
Silva, C.
6 / 69 shared
Correia, J. B.
1 / 19 shared
Mardolcar, U. V.
2 / 5 shared
Correia, Jorge
6 / 10 shared
Hanada, K.
5 / 10 shared
Alves, E.
3 / 129 shared
Mateus, A. R.
3 / 5 shared
Carvalho, Patrícia Almeida
1 / 7 shared
Silva, Carlos
1 / 8 shared
Correia, José Brito
1 / 1 shared
Fernandes, Horácio
1 / 1 shared
Osawa, E.
4 / 8 shared
Nogueira, I. D.
1 / 1 shared
Chart of publication period
2013
2012
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Co-Authors (by relevance)

  • Carvalho, P. A.
  • Liberal Fernandes, Hugo
  • Shohoji, N.
  • Nunes, Daniela
  • Silva, C.
  • Correia, J. B.
  • Mardolcar, U. V.
  • Correia, Jorge
  • Hanada, K.
  • Alves, E.
  • Mateus, A. R.
  • Carvalho, Patrícia Almeida
  • Silva, Carlos
  • Correia, José Brito
  • Fernandes, Horácio
  • Osawa, E.
  • Nogueira, I. D.
OrganizationsLocationPeople

document

Consolidation of Cu-nDiamond nanocomposites

  • Hanada, K.
  • Carvalho, P. A.
  • Correia, Jorge
  • Livramento, V.
  • Liberal Fernandes, Hugo
  • Shohoji, N.
  • Nunes, Daniela
  • Alves, E.
  • Osawa, E.
  • Silva, C.
  • Mateus, A. R.
Abstract

<p>Due to their interesting properties copper-based materials have been considered appropriate heat-sinks for first wall panels in nuclear fusion devices. The concept of property tailoring involved in the design of metal matrix composites has led to several attempts to use nanodiamond (nDiamond) as reinforcement. In particular, nDiamond produced by detonation has been used to reinforce copper. In the present study, powder mixtures of copper and nDiamond with 20 at. % C were mechanically alloyed (MA) and consolidated via hot extrusion or spark plasma sintering (SPS). The hardness evolutions as well as the structural characterization of as-milled nanocomposite powders and consolidated samples are reported. Density measurements indicate that the consolidation outcome varies significantly with the process used. Transmission electron microscopy (TEM) inspection of the extrusion consolidated sample revealed bonding at the interface between copper and nDiamond particles. The nDiamond size distribution was determined from TEM observations. The results obtained are discussed in terms of consolidation routes.</p>

Topics
  • nanocomposite
  • density
  • hardness
  • transmission electron microscopy
  • copper
  • sintering
  • hot extrusion