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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Mahesh, Karimbi Koosappa
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (22/22 displayed)
- 2013In situ structural characterization of laser welded NiTi shape memory alloyscitations
- 2013Simultaneous probing of phase transformations in Ni-Ti thin film Shape Memory Alloy by synchrotron radiation-based X-ray diffraction and Electrical Resistivitycitations
- 2012In situ study of thermomechanical cycling of shape memory alloys
- 2012Textural Evolution Evaluated by EBSD and XRD after Thermal Treatment in Ni-Ti Shape Memory Alloy
- 2011Concurrent Effect of Melt-spinning and Severe Plastic Deformation on Shape Memory Alloy Ribbons by Simultaneous XRD and Electrical Resistivity Measurements
- 2011Combined in-situ XRD and Electrical Resistivity Study of the Phase Transformations in Ni-Ti SMA
- 2011Stability in Phase Transformation After Multiple Steps of Marforming in Ti-Rich Ni-Ti Shape Memory Alloycitations
- 2011Simultaneous XRD and Electrical Resistivity Measurements of the phase transitions in Co-Ni-Ga ferromagnetic shape memory alloy system
- 2010Phase Transformation in Ni-Ti Shape Memory and Superelastic Alloys Subjected to High Pressure Torsion
- 2010XRD study of the transformation characteristics of severely plastic deformed Ni-Ti SMAscitations
- 2010Textural Modifications during Recovery in Ti-Rich Ni-Ti Shape Memory Alloy Subjected to Low Level of Cold Work Reduction
- 2010Phase transformation and structural study on the severely plastic deformed Ni-Ti alloyscitations
- 2009In-situ XRD and Electrical Resistivity Study of the Phase transformations in Ni-Ti Shape Memory Alloys (SMA)
- 2008Electric resistance variation of NiTi shape memory alloy wires in thermomechanical tests: Experiments and simulationcitations
- 2008The interfacial diffusion zone in magnetron sputtered Ni-Ti thin films deposited on different Si substrates studied by HR-TEMcitations
- 2008Thermomechanical behavior of Ti-rich NiTi shape memory alloyscitations
- 2007In-situ study of Ni-Ti thin film growth on a TiN intermediate layer by X-ray diffractioncitations
- 2007X-ray diffraction study of the phase transformations in NiTi shape memory alloycitations
- 2006One- and two-step phase transformation in Ti-rich NiTi shape memory alloy
- 2006Kinetics characterization of martensitic transformation on Ti-rich Ni-Ti SMA
- 2006Texture evolution during annealing of Ni-Ti shape memory alloy
- 2006Study of the textural evolution in Ti-rich NiTi using synchrotron radiationcitations
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document
The interfacial diffusion zone in magnetron sputtered Ni-Ti thin films deposited on different Si substrates studied by HR-TEM
Abstract
<p>Ni-Ti Shape Memory Alloy thin films are suitable materials for microelectromechanical devices. During the deposition of Ni-Ti thin films on Si substrates, there exist interfacial diffusion and chemical interactions at the interface due to the high temperature processing necessary to crystallize the film. For the present study, Ni-Ti thin films were prepared by magnetron co-sputtering from Ni-Ti and Ti targets in a specially designed chamber mounted on the 6-circle goniometer of the ROssendorf BeamLine (ROBL-CRG) at ESRF, Grenoble (France). The objective of this study has been to investigate the interfacial structure resulting from depositions (at a temperature of ≈470°C) on different substrates: naturally oxidized Si(100), Si(111) and poly-Si substrates. A detailed High-Resolution TEM analysis of the interfacial structure has been performed. When Ni-Ti is deposited on Si(100) substrate, a considerable diffusion of Ni into the substrate takes place, resulting in the growth of semi-octaeder A-NiSi<sub>2</sub> silicide. In the case of Ni-Ti deposited on Si(111), there appears an uniform thickness plate, due to the alignment between substrate orientation and the [111]-growth front. For Ni-Ti deposited on poly-Si, the diffusion is inhomogeneous. Preferential diffusion is found along the columnar grains of poly-Si, which are favourably aligned for Ni diffusion. These results show that for the Ni-Ti/Si system, the morphology of the diffusion interface is strongly dependent on the type of substrates.</p>