Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (3/3 displayed)

  • 2022Via Size-Dependent Properties of TiAl Ohmic Contacts on 4H-SiC7citations
  • 2020Reducing On-Resistance for SiC Diodes by Thin Wafer and Laser Anneal Technology10citations
  • 2020Low-Resistance Ohmic Contact Formation by Laser Annealing of N-Implanted 4H-SiC9citations

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Chart of shared publication
Beuer, Susanne
1 / 2 shared
Rommel, Mathias
2 / 13 shared
May, Alexander
1 / 1 shared
Corcoran, Yunji
1 / 1 shared
Hellinger, Carsten
2 / 2 shared
Rusch, Oleg
2 / 2 shared
Moult, Jonathan
1 / 1 shared
Bauer, Anton J.
1 / 2 shared
Chart of publication period
2022
2020

Co-Authors (by relevance)

  • Beuer, Susanne
  • Rommel, Mathias
  • May, Alexander
  • Corcoran, Yunji
  • Hellinger, Carsten
  • Rusch, Oleg
  • Moult, Jonathan
  • Bauer, Anton J.
OrganizationsLocationPeople

article

Low-Resistance Ohmic Contact Formation by Laser Annealing of N-Implanted 4H-SiC

  • Hellinger, Carsten
  • Bauer, Anton J.
  • Rusch, Oleg
  • Rommel, Mathias
  • Erlbacher, Tobias
Abstract

<jats:p>In this work, pulsed-laser-based tempering was applied for post-implant annealing of n-type N-doped 4H-SiC in order to electrically activate the dopants and to rebuild the crystal structure. The annealing was performed by a frequency-tripled Nd:YVO<jats:sub>4</jats:sub>laser with a pulse duration of 60 ns. To evaluate the effects of post-implant annealing, JBS diodes were electrically characterized. The results were compared with implanted, not post-annealed JBS diodes. The electrical measurements showed a significant on-state voltage drop of 40 mV at 6 A for post-implant laser annealed diodes compared to not post-implant annealed diodes.</jats:p>

Topics
  • annealing
  • tempering