| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Roy, Sudipta
University of Strathclyde
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (25/25 displayed)
- 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloyscitations
- 2022Modelling the scaling-up of the nickel electroforming processcitations
- 2022Characteristics of anode materials for nickel electroformingcitations
- 2021Pulse electrodeposition of copper in the presence of a corrosion reactioncitations
- 2020Effect of water on the electrodeposition of copper from a deep eutectic solventcitations
- 2019Investigation of water absorption profile of mineral wool insulation
- 2019Electrodeposition of Fe-Sn from the chloride-based electrolytecitations
- 2019Electroforming of large scale nickel structures for leading-edge energy, aerospace and marine applications
- 2018Anodic reactions and the corrosion of copper in deep eutectic solventscitations
- 2018Pt-Ni Subsurface Alloy Catalystscitations
- 2018Electrodeposition of Cu from a water-containing deep eutectic solvent
- 2018Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gapcitations
- 2017The influence of water on the cathodic voltammetric responses of choline chloride-urea and choline chloride-ethylene glycol deep eutectic solvents
- 2017Pulse plating of copper from deep eutectic solventscitations
- 2017Electrodeposition of copper from deep eutectic solvents by using pulse current
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2016Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approachcitations
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2015A soluble molecular variant of the semiconducting silicondiselenidecitations
- 2015The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acidcitations
- 2015Codeposition of Cu-Sn from ethaline deep eutectic solventcitations
- 2014Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gapcitations
- 2014Electrochemical copper deposition from an ethaline-CuCl2·2H2O DEScitations
- 2012Pulse Plating
Places of action
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article
The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid
Abstract
<p>Methanesulfonic acid (MSA) is an environmentally benign supporting electrolyte that is an attractive alternative to traditional copper and tin plating baths based on cyanide or fluoborate. This is mainly due to its low toxicity, volatility, and good biodegradability as well as other desirable characteristics for electrodeposition such as high metal salt solubility and conductivity. The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid was explored through the use of an electrochemical quartz crystal nano-balance to monitor surfactant adsorption and desorption from the electrode surface. It was found that the surfactant adsorbs on the surface and inhibits copper deposition by blocking the reduction and oxidation reaction for copper.</p>