Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2018Direct Active Soldering of PEO Coated and Uncoated AA6061 Aluminium Alloycitations

Places of action

Chart of shared publication
Unni, Anoop K.
1 / 1 shared
Muthupandi, Veerappan
1 / 2 shared
Sokkalingam, R.
1 / 7 shared
Shankar, M. P.
1 / 1 shared
Sivaprasad, K.
1 / 4 shared
Chart of publication period
2018

Co-Authors (by relevance)

  • Unni, Anoop K.
  • Muthupandi, Veerappan
  • Sokkalingam, R.
  • Shankar, M. P.
  • Sivaprasad, K.
OrganizationsLocationPeople

article

Direct Active Soldering of PEO Coated and Uncoated AA6061 Aluminium Alloy

  • Unni, Anoop K.
  • Muthupandi, Veerappan
  • Sokkalingam, R.
  • Shankar, M. P.
  • Sivaprasad, K.
  • Anoop, K. Unni
Abstract

<jats:p>Active soldering is an emerging technology of joining a range of materials, which utilizes Sn-Ag composition solder alloy other than conventional Sn-Pb solder, along with reactive element additions (like Ti, Ta, Hf and Zr). In the present study, active soldering is employed for bonding AA6061 aluminium alloy using S Bond 220-50 and S Bond 220M active solders. Soldering was achieved by direct active soldering of AA6061 plates each other using S Bond 220-50 and PEO coated AA6061 aluminium alloy using S Bond 220M, taking into consideration of the application of active solder alloy in joining ceramics. Mechanical properties were evaluated using hardness and lap shear test. Microstructure analysis is carried out by SEM microscopy. The soldered area is examined using EDS giving fair idea regarding the composition of elements present in the solder. It is observed that direct bonding of aluminium alloy using S Bond 220-50 showed better bond strength and hardness when compared with joining using S Bond 220M of the PEO coated aluminium plate.</jats:p>

Topics
  • impedance spectroscopy
  • microstructure
  • scanning electron microscopy
  • aluminium
  • reactive
  • strength
  • shear test
  • aluminium alloy
  • hardness
  • Energy-dispersive X-ray spectroscopy
  • ceramic
  • joining