Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2008Heat Sink Materials Processing by Pulse Plasma Sintering18citations

Places of action

Chart of shared publication
Rosiński, Marcin
1 / 11 shared
Kurzydłowski, Krzysztof J.
1 / 9 shared
Siemiaszko, Dariusz
1 / 10 shared
Michalski, Andrzej
1 / 13 shared
Chart of publication period
2008

Co-Authors (by relevance)

  • Rosiński, Marcin
  • Kurzydłowski, Krzysztof J.
  • Siemiaszko, Dariusz
  • Michalski, Andrzej
OrganizationsLocationPeople

article

Heat Sink Materials Processing by Pulse Plasma Sintering

  • Rosiński, Marcin
  • Ciupiński, Łukas
  • Kurzydłowski, Krzysztof J.
  • Siemiaszko, Dariusz
  • Michalski, Andrzej
Abstract

A Pulse Plasma Sintering (PPS) process was employed to manufacture Cu-diamond composites with a 50% volume fraction of each constituent. Pure and Cr (0.8wt.%) alloyed copper matrices were used and commercial diamond powders. The composites were sintered at temperature of 900°C for 20 min and under pressure of 60 MPa. In these sintering conditions diamond becomes thermodynamically unstable. Cu0.8Cr-diamond and Cu-diamond composites with relative densities of 99,7% and 96% respectively were obtained. The thermal conductivity of Cu0.8Cr-diamond composite is equal to 640 W(mK)-1 whereas that of Cu-diamond is 200 W(mK)-1. The high thermal conductivity and relative density of Cu0.8Cr-diamond composite is due to the formation of a thin chromium carbide layer at the Cu-diamond interface.

Topics
  • density
  • impedance spectroscopy
  • chromium
  • carbide
  • composite
  • copper
  • thermal conductivity
  • sintering