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Gąsior, W.
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article
(Sn-Ag)eut Cu Soldering Materials, Part II
Abstract
Electical (solder resistivity and solder joing resistance) and mechanical (tensile strength and shear strength of solder joints) parameters of the binary eutectic Sn-Ag and two alloys close to the ternary eutectic Sn-Ag-Cu composition wre investigated. The four-probe technique was used for the measurement of electical parameters. Special ewuipment was constucted for the tensile strngth measurements and also for determination of the shear strenghs of solder joints between a typical circuit component and a Cu contact on a printed circuit board (PCB).It was found that electical and mechanical properties of the three alloys studied are comparable to data in the literaturę for traditional Pb-Sn solders. A joint resistance below 0.3m ohm and shera strength of above 20 Mpa were found for aan individual solder joint between a circuit component (in the current study a "jumper" resistor) and a copper surface on a PCB.