Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2023Development and Investigation of High-Temperature Ultrasonic Measurement Transducers Resistant to Multiple Heating–Cooling Cycles2citations

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Chart of shared publication
Vaskeliene, Vaida
1 / 1 shared
Žukauskas, Egidijus
1 / 1 shared
Mazeika, Liudas
1 / 2 shared
Sliteris, Reimondas
1 / 2 shared
Chart of publication period
2023

Co-Authors (by relevance)

  • Vaskeliene, Vaida
  • Žukauskas, Egidijus
  • Mazeika, Liudas
  • Sliteris, Reimondas
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article

Development and Investigation of High-Temperature Ultrasonic Measurement Transducers Resistant to Multiple Heating–Cooling Cycles

  • Vaskeliene, Vaida
  • Žukauskas, Egidijus
  • Mazeika, Liudas
  • Kazys, Rymantas Jonas
  • Sliteris, Reimondas
Abstract

<jats:p>Usually for non-destructive testing at high temperatures, ultrasonic transducers made of PZT and silver electrodes are used, but this could lead to damage to or malfunction of the ultrasonic transducer due to poor adhesion between PZT and silver. Soldering is one of the most common types of bonding used for individual parts of ultrasonic transducers (protector, backing, matching layer, etc.), but silver should be protected using additional metal layers (copper) due to its solubility in solder. A mathematical modelling could help to predict if an ultrasonic transducer was manufactured well and if it could operate up to 225 °C. The observed von Mises stresses were very high and concentrated in metal layers (silver and copper), which could lead to disbonding under long-term cyclic temperature loads. This paper presents a multilayer ultrasonic transducer (PZT, silver electrodes, copper layers, backing), which was heated evenly from room temperature to 225 °C and then cooled down. In the B-scan, it was observed that the amplitude of the reflected signal from the bottom of the sample decreased with an increase in temperature. However, after six heating–cooling cycles, the results repeated themselves and no signs of fatigue were noticed. This ultrasonic transducer was well manufactured and could be used for non-destructive testing when the environment temperature changes in cycles up to 225 °C.</jats:p>

Topics
  • impedance spectroscopy
  • silver
  • fatigue
  • copper
  • ultrasonic