Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (5/5 displayed)

  • 2024Process optimization of the morphological properties of epoxy resin molding compounds using response surface design5citations
  • 2024In situ monitoring of the curing of highly filled epoxy molding compounds: the influence of reaction type and silica content on cure kinetic models8citations
  • 2024Optimizing epoxy molding compound processing: a multi-sensor approach to enhance material characterization and process reliabilitycitations
  • 2014Current Patterns and Orbital Magnetism in Mesoscopic dc Transport33citations
  • 2013C58 on Au(111): A scanning tunneling microscopy study13citations

Places of action

Chart of shared publication
Vogelwaid, Julian
3 / 3 shared
Jacob, Timo
3 / 22 shared
Kutuzova, Larysa
3 / 7 shared
Kandelbauer, Andreas
3 / 21 shared
Bayer, Martin
3 / 3 shared
Lorenz, Günter
2 / 12 shared
Hampel, Felix
2 / 2 shared
Evers, Ferdinand
2 / 4 shared
Wilhelm, Jan
2 / 2 shared
Bagrets, Alexei
1 / 1 shared
Miyamashi, Toshio
1 / 1 shared
Kern, Bastian
1 / 1 shared
Bajales, Noelia
1 / 2 shared
Ulas, Seyithan
1 / 1 shared
Stendel, Melanie
1 / 1 shared
Böttcher, Artur
1 / 2 shared
Schmaus, Stefan
1 / 1 shared
Kappes, Manfred M.
1 / 4 shared
Wulfhekel, Wulf
1 / 9 shared
Chart of publication period
2024
2014
2013

Co-Authors (by relevance)

  • Vogelwaid, Julian
  • Jacob, Timo
  • Kutuzova, Larysa
  • Kandelbauer, Andreas
  • Bayer, Martin
  • Lorenz, Günter
  • Hampel, Felix
  • Evers, Ferdinand
  • Wilhelm, Jan
  • Bagrets, Alexei
  • Miyamashi, Toshio
  • Kern, Bastian
  • Bajales, Noelia
  • Ulas, Seyithan
  • Stendel, Melanie
  • Böttcher, Artur
  • Schmaus, Stefan
  • Kappes, Manfred M.
  • Wulfhekel, Wulf
OrganizationsLocationPeople

article

Optimizing epoxy molding compound processing: a multi-sensor approach to enhance material characterization and process reliability

  • Vogelwaid, Julian
  • Walz, Michael
  • Jacob, Timo
  • Kutuzova, Larysa
  • Lorenz, Günter
  • Hampel, Felix
  • Kandelbauer, Andreas
  • Bayer, Martin
Abstract

The in-line control of curing during the molding process significantly improves product quality and ensures the reliability of packaging materials with the required thermo-mechanical and adhesion properties. The choice of the morphological and thermo-mechanical properties of the molded material, and the accuracy of their determination through carefully selected thermo-analytical methods, play a crucial role in the qualitative prediction of trends in packaging product properties as process parameters are varied. This work aimed to verify the quality of the models and their validation using a highly filled molding resin with an identical chemical composition but 10 wt% difference in silica particles (SPs). Morphological and mechanical material properties were determined by dielectric analysis (DEA), differential scanning calorimetry (DSC), warpage analysis and dynamic mechanical analysis (DMA). The effects of temperature and injection speed on the morphological properties were analyzed through the design of experiments (DoE) and illustrated by response surface plots. A comprehensive approach to monitor the evolution of ionic viscosity (IV), residual enthalpy (dHrest), glass transition temperature (Tg), and storage modulus (E) as a function of the transfer-mold process parameters and post-mold-cure (PMC) conditions of the material was established. The reliability of Tg estimation was tested using two methods: warpage analysis and DMA. The noticeable deterioration in the quality of the analytical signal for highly filled materials at high cure rates is discussed. Controlling the temperature by increasing the injection speed leads to the formation of a polymer network with a lower Tg and an increased storage modulus, indicating a lower density and a more heterogeneous structure due to the high heating rate and shear heating effect.

Topics
  • density
  • impedance spectroscopy
  • surface
  • compound
  • polymer
  • experiment
  • glass
  • glass
  • viscosity
  • chemical composition
  • thermogravimetry
  • glass transition temperature
  • differential scanning calorimetry
  • resin
  • curing
  • dynamic mechanical analysis