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| Naji, M. |
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| Motta, Antonella |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Petrov, R. H. | Madrid |
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| Kočí, Jan | Prague |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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Caseri, Walter
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2022Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasmacitations
- 2022Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demandcitations
- 2020Polymer-assisted in-situ thermal reduction of silver precursors: a solventless route for silver nanoparticles-polymer compositescitations
- 2000Oriented nanocomposites of ultrahigh-molecular-weight polyethylene and goldcitations
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article
Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demand
Abstract
Recycling adhesively bonded polymers is inconvenient due to its expensive separation and removal of adhesive residues. To tackle this problem, adhesive technologies are needed allowing debonding on demand and which do not contaminate the surface of the substrate. Direct bonding enabled by oxygen plasma treatment has already achieved substantial adhesion between flat substrates. However, debonding takes place by water, thus limiting the applications of this technology to water-free environments. The work presented in the following shows that this drawback can be overcome by grafting acrylic acid and adding copper(II) ions on the surface of polystyrene. In this process, the number of functional groups on the surface was significantly increased without increasing the surface roughness. The bonding strength between the substrates could be increased, and the process temperature could be lowered. Nevertheless, the samples could be debonded by exposure to EDTA solution under ultrasound. Hence, by combining acrylic acid grafting, variations in the bonding temperatures and the use of copper(II) ions, the bonding strength (5 N to >85 N) and the debonding time under the action of water can be tuned over large ranges (seconds to complete resistance).