| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Sanchez, Sergio Gonzalez
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2023Investigation of the strain rate sensitivity of CoCrFeMnNiTix (x=0, 0.3) high-entropy alloys using the shear punch testcitations
- 2022A Critical Review on Al-Co Alloys: Fabrication Routes, Microstructural Evolution and Propertiescitations
- 2022Tribological Behavior of Microalloyed Cu50Zr50 Alloy
- 2022Conductivity Behaviour under Pressure of Copper Micro-Additive/Polyurethane Composites (Experimental and Modelling)citations
- 2022Unravelling the combined effect of cooling rate and microalloying on the microstructure and tribological performance of Cu50Zr50citations
- 2020Wear rate at RT and 100 °C and operating temperature range of microalloyed Cu50Zr50 shape memory alloycitations
- 2019Stress-induced martensitic transformation of Cu50Zr50 shape memory alloy optimized through microalloying and co-microalloyingcitations
- 2018Tuning the antimicrobial behaviour of Cu85Zr15 thin films in “wet” and “dry” conditions through structural modificationscitations
- 2017Copper-rich metallic glass composite as antimicrobial material
Places of action
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article
Conductivity Behaviour under Pressure of Copper Micro-Additive/Polyurethane Composites (Experimental and Modelling)
Abstract
In this study, micro-size copper particles (less than 25 μm) were incorporated into polyurethane (PU) using a solution mixing method and spin-coating technique to fabricate composite films in concentrations from 0.5 to 20 vol.%. The conductivity behaviour of these composites under pressure was studied experimentally and numerically. The conductivity measurements were performed in-plane and through-thickness under pressure. It was found that changes in conductivity only occurred in the z-direction under an applied pressure from 1 to 20 kPa. The results showed that pressure could induce conductivity up to about 7.2 × 10−1 S∙m−1 for composites with a Cu concentration higher than 2.6 vol.%. It seems that applied pressure reduced the thickness of the polymer film, decreasing the distance between copper particles and promoting the formation of a conductive network, thus making the material conductive. A semi-analytical model that can accurately provide the percolation threshold (PT) concentration was used to fit the experimental conductivity. The PT concentrations for PU-Cu composite ranged from 7.1 vol.% to 1.4 vol.% and decreased with the rise in pressure. This is known as a pressure-induced percolation transition phenomenon (PIPT). Finally, the finite element method based on the representative volume element model (FE-RVE) simulation technique was used to predict the conductivity behaviour. This numerical simulation provided a good description of the experimental conductivity after the PT and correctly predicted the PT concentration. This study shows that FE-RVE could be used to effectively simulate the influence of pressure on the electrical properties of a polymer–metal composite, reducing the need for costly and time-consuming experiments.