| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Santos, Rf
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2024Benchmarking L-PBF Systems for Die Production: Powder, Dimensional, Surface, Microstructural and Mechanical Characterisationcitations
- 2022Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysiscitations
- 2022Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnectscitations
- 2022PMMA Lens Arrays for Micro Concentrator Solar Cells Produced by Hot Embossing
- 2021The effect of Cr content on the corrosion resistance of WC-Ni-Cr-Mo compositescitations
- 2020Microstructural characterization and corrosion resistance of WC-Ni-Cr-Mo composite - The effect of Mocitations
- 2017In the search of nanocrystallinity in tool-steel chipscitations
- 2017Superparamagnetic core-shell nanocomplexes doped with Yb3+:Er3+/Ho3+ rare-earths for upconversion fluorescencecitations
Places of action
| Organizations | Location | People |
|---|
article
Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis
Abstract
The back-end-of-line (BEOL) copper interconnect structure has been subjected to downscaling for the last two decades, while the materials used for conforming and assuring its physical integrity during processing have faced significant obstacles as the single-digit nanometer process node is implemented. In particular, the diffusion barrier layer system comprised of Ta/TaN has faced major constraints when it comes to the electrical performance of the smaller Cu lines, and thus alternative formulations have been investigated in recent years, such as Ru-Ta or Co-W alloys. In this work, we assess how PVD (physical vapor deposition) deposited equimolar Co-W films perform when exposed to different vacuum annealing temperatures and how these films compare with the Ta adhesion layer used for Cu seeding in terms of dewetting resistance. The stacks were characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) coupled with energy dispersive X-ray spectroscopy (EDX) mapping. The Cu film at the surface of the Cu/Co-W system exhibited grain growth starting at 300 degrees C, with the formation of abnormally large Cu grains starting at 450 degrees C. Sheet resistance reached a minimum value of 7.07 x 10(-6) omega/sq for the Cu/Co-W stack and 6.03 x 10(-6) omega/sq for the Cu/Ta stack, both for the samples annealed at 450 degrees C.