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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Simões, Sónia
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Topics
Publications (9/9 displayed)
- 2024Production and Characterization of Hybrid Al6061 Nanocomposites
- 2024High-Performance Advanced Composites in Multifunctional Material Design: State of the Art, Challenges, and Future Directionscitations
- 2024Recent Advances in Hybrid Nanocomposites for Aerospace Applicationscitations
- 2023Production and Characterization of Aluminum Reinforced with SiC Nanoparticlescitations
- 2021Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formationcitations
- 2021Strengthening Mechanisms of Aluminum Matrix Nanocomposites Reinforced with CNTs Produced by Powder Metallurgycitations
- 2019Joining of TiAl alloy using novel Ag-Cu sputtered coated Ti brazing fillercitations
- 2018Joining of γ-TiAl alloy to Ni-Based superalloy using Ag-Cu sputtered coated Ti brazing filler foilcitations
- 2017Electrical and Tensile Properties of Carbon Nanotubes-Reinforced Aluminum Alloy 6101 Wirecitations
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article
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation
Abstract
The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable electrical properties and barrier layer efficiency at reduced thicknesses while enabling seedless Cu electroplating. The microstructure, morphology, and electrical properties of Cu films directly electrodeposited onto Co-W or Ru-W are important to assess, concomitant with their ability to withstand the electroplating baths/conditions. This work investigates the effects of the current application method and pH value of the electroplating solution on the electrocrystallisation behaviour of Cu deposited onto a Co-W barrier layer. The film structure, morphology, and chemical composition were studied by X-ray diffraction, scanning electron microscopy and atomic force microscopy, as well as photoelectron spectroscopy. The results show that the electrolyte solution at pH 1.8 is incapable of creating a compact Cu film over the Co-W layer in either pulsed or direct-current modes. At higher pH, a continuous film is formed. A mechanism is proposed for the nucleation and growth of Cu on Co-W, where a balance between Cu nucleation, growth, and preferential Co dissolution dictates the substrate area coverage and compactness of the electrodeposited films. ; Portugal 2020 through European Regional Development Fund (FEDER) in the frame of Operational Competitiveness and Internationalisation Programme (POCI) and in the scope of the project USECoIN with grant number PTDC/CTM-CTM/31953/2017. This work was also supported by FCT, through IDMEC, under LAETA project UIDB/50022/2020