| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Viana, Filomena
Universidade do Porto
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2024Wear Rate, Tribo-Corrosion, and Plastic Deformation Values of Co-Cr-Mo Alloy in Ringer Lactate Solutioncitations
- 2023Scratch and Wear Behaviour of Co-Cr-Mo Alloy in Ringer’s Lactate Solutioncitations
- 2021Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formationcitations
- 2021Preliminary tribocorrosion evaluation of bio-functionalized Ti doped with Ca-P-Srcitations
- 2012CNT-aluminum metal matrix nanocomposites
- 2010Brazing Ti-47Al-2Cr-2Nb to Inconel 718 with different filler alloys: microstructural characterization of the interfaces
- 2006Assessing the influence of heat treatments on γ-TiAl joints
- 2006Assessing the influence of heat treatments on y-TiAl joints
- 2003Joining Ti-47Al-2Cr-2Nb with a Ti/(Cu,Ni)/Ti clad-laminated braze alloycitations
- 2003The influence of the processing temperature on the microstructure of gamma-TiAl joints brazed with a Ti-15Cu-15Ni alloycitations
- 2001Multilayered interface in Ti/Macor (R) machinable glass-ceramic jointscitations
- 2000Zr bearing gama-TiAl induction meltedcitations
- 2000Zr bearing gamma-TiAl induction melted
Places of action
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article
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation
Abstract
The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable electrical properties and barrier layer efficiency at reduced thicknesses while enabling seedless Cu electroplating. The microstructure, morphology, and electrical properties of Cu films directly electrodeposited onto Co-W or Ru-W are important to assess, concomitant with their ability to withstand the electroplating baths/conditions. This work investigates the effects of the current application method and pH value of the electroplating solution on the electrocrystallisation behaviour of Cu deposited onto a Co-W barrier layer. The film structure, morphology, and chemical composition were studied by X-ray diffraction, scanning electron microscopy and atomic force microscopy, as well as photoelectron spectroscopy. The results show that the electrolyte solution at pH 1.8 is incapable of creating a compact Cu film over the Co-W layer in either pulsed or direct-current modes. At higher pH, a continuous film is formed. A mechanism is proposed for the nucleation and growth of Cu on Co-W, where a balance between Cu nucleation, growth, and preferential Co dissolution dictates the substrate area coverage and compactness of the electrodeposited films. ; Portugal 2020 through European Regional Development Fund (FEDER) in the frame of Operational Competitiveness and Internationalisation Programme (POCI) and in the scope of the project USECoIN with grant number PTDC/CTM-CTM/31953/2017. This work was also supported by FCT, through IDMEC, under LAETA project UIDB/50022/2020