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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Daniel, Rostislav
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2022Impact of Si on the high-temperature oxidation of AlCr(Si)N coatingscitations
- 2022Precipitation-based grain boundary design alters Inter- to Trans-granular Fracture in AlCrN Thin Filmscitations
- 2022Biocompatibility and antibacterial properties of TiCu(Ag) thin films produced by physical vapor deposition magnetron sputteringcitations
- 2022Biocompatibility and antibacterial properties of TiCu(Ag) thin films produced by physical vapor deposition magnetron sputteringcitations
- 2022Microstructure-dependent phase stability and precipitation kinetics in equiatomic CrMnFeCoNi high-entropy alloy: Role of grain boundariescitations
- 2021Ion irradiation-induced localized stress relaxation in W thin film revealed by cross-sectional X-ray nanodiffractioncitations
- 2021Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Filmscitations
- 2020Nanoscale stress distributions and microstructural changes at scratch track cross-sections of a deformed brittle-ductile CrN-Cr bilayercitations
- 2020Evolution of stress fields during crack growth and arrest in a brittle-ductile CrN-Cr clamped-cantilever analysed by X-ray nanodiffraction and modellingcitations
- 2019Anisotropy of fracture toughness in nanostructured ceramics controlled by grain boundary designcitations
- 2019Stress-controlled decomposition routes in cubic AlCrN films assessed by in-situ high-temperature high-energy grazing incidence transmission X-ray diffractioncitations
- 201830 nm X-ray focusing correlates oscillatory stress, texture and structural defect gradients across multilayered TiN-SiOx thin filmcitations
- 2017Peculiarity of self-assembled cubic nanolamellae in the TiN/AlN systemcitations
- 2016In-situ Observation of Cross-Sectional Microstructural Changes and Stress Distributions in Fracturing TiN Thin Film during Nanoindentationcitations
- 2016Hierarchical Architectures to Enhance Structural and Functional Properties of Brittle Materialscitations
- 2016Cross-sectional structure-property relationship in a graded nanocrystalline Ti1-xAlxN thin filmcitations
- 2014Novel nanocomposite coatings
- 2014Mono-textured nanocrystalline thin films with pronounced stress-gradientscitations
Places of action
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article
Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films
Abstract
In this work, the ternary titanium, copper, and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition-magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by X-ray diffraction (XRD), nanoindentation (modulus and hardness), to quantitatively evaluate the scratch adhesion, and atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick, and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness, respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (-36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.