| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Giagka, Vasiliki
Fraunhofer Institute for Reliability and Microintegration
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2023Non-monolithic fabrication of thin-film microelectrode arrays on PMUT transducers as a bimodal neuroscientific investigation toolcitations
- 2023Non-monolithic fabrication of thin-film microelectrode arrays on PMUT transducers as a bimodal neuroscientific investigation toolcitations
- 2023A Comparative Study of Si3N4 and Al2O3 as Dielectric Materials for Pre-Charged Collapse-Mode CMUTscitations
- 2023An Ultrasonically Powered System Using an AlN PMUT Receiver for Delivering Instantaneous mW-Range DC Power to Biomedical Implantscitations
- 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimationcitations
- 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimationcitations
- 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfacescitations
- 2022Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfacescitations
- 2022Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implantscitations
- 2021Silicone encapsulation of thin-film SiOx , SiOx Ny and SiC for modern electronic medical implantscitations
- 2021Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: A comparative long-term ageing studycitations
- 2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: a comparative long-term ageing studycitations
- 2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants
- 2020Soft, flexible and transparent graphene-based active spinal cord implants for optogenetic studies
- 2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implantscitations
- 2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implantscitations
- 2019The influence of soft encapsulation materials on the wireless power transfer links efficiency
- 2019Towards an Active Graphene-PDMS Implant
- 2018MEMS-Electronics Integration 2: A Smart Temperature Sensor for an Organ-on-a-chip Platform
- 2015Flexible active electrode arrays with ASICs that fit inside the rat's spinal canalcitations
Places of action
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article
Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants
Abstract
Liquid crystal polymer (LCP) has gained wide interest in the electronics industry largely due to its flexibility, stable insulation and dielectric properties and chip integration capabilities. Recently, LCP has also been investigated as a biocompatible substrate for the fabrication of multielectrode arrays. Realizing a fully implantable LCP-based bioelectronic device, however, still necessitates a low form factor packaging solution to protect the electronics in the body. In this work, we investigate two promising encapsulation coatings based on thin-film technology as the main packaging for LCP-based electronics. Specifically, a HfO2–based nanolaminate ceramic (TFE1) deposited via atomic layer deposition (ALD), and a hybrid Parylene C-ALD multilayer stack (TFE2), both with a silicone finish, were investigated and compared to a reference LCP coating. T-peel, water-vapour transmission rate (WVTR) and long-term electrochemical impedance spectrometry (EIS) tests were performed to evaluate adhesion, barrier properties and overall encapsulation performance of the coatings. Both TFE materials showed stable impedance characteristics while submerged in 60 °C saline, with TFE1-silicone lasting more than 16 months under a continuous 14V DC bias (experiment is ongoing). The results presented in this work show that WVTR is not the main factor in determining lifetime, but the adhesion of the coating to the substrate materials plays a key role in maintaining a stable interface and thus longer lifetimes.