Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Publications (1/1 displayed)

  • 2023Effect of Er, Si, Hf and Nb Additives on the Thermal Stability of Microstructure, Electrical Resistivity and Microhardness of Fine-Grained Aluminum Alloys of Al-0.25%Zr10citations

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Kopylov, Vladimir
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Nagicheva, Galina S.
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Tabachkova, Natalia
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2023

Co-Authors (by relevance)

  • Kopylov, Vladimir
  • Nagicheva, Galina S.
  • Tabachkova, Natalia
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article

Effect of Er, Si, Hf and Nb Additives on the Thermal Stability of Microstructure, Electrical Resistivity and Microhardness of Fine-Grained Aluminum Alloys of Al-0.25%Zr

  • Kopylov, Vladimir
  • Bobrov, Aleksandr A.
  • Nagicheva, Galina S.
  • Tabachkova, Natalia
Abstract

<jats:p>The conductor aluminum alloys of Al-0.25wt.%Zr alloyed additionally with X = Er, Si, Hf and Nb were the objects of our investigations. The fine-grained microstructure in the alloys was formed via equal channel angular pressing and rotary swaging. The thermal stability of the microstructure, specific electrical resistivity and microhardness of the novel conductor aluminum alloys were investigated. The mechanisms of nucleation of the Al3(Zr, X) secondary particles during annealing the fine-grained aluminum alloys were determined using the Jones–Mehl–Avrami–Kolmogorov equation. Using the Zener equation, the dependencies of the average secondary particle sizes on the annealing time were obtained on the base of the analysis of the data on the grain growth in the aluminum alloys. The secondary particle nucleation during long-time low-temperature annealing (300 °C, 1000 h) was shown to go preferentially at the cores of the lattice dislocations. The Al-0.25%Zr-0.25%Er-0.20%Hf-0.15%Si alloy subjected to long-time annealing at 300 °C has the optimal combination of microhardness and electrical conductivity (59.8%IACS, Hv = 480 ± 15 MPa).</jats:p>

Topics
  • grain
  • resistivity
  • aluminium
  • dislocation
  • annealing
  • electrical conductivity
  • grain growth