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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Khani, Somayeh
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- 2022Selective laser melting of CuSn10: simulation of mechanical properties, microstructure, and residual stressescitations
- 2022Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stressescitations
- 2021Height of water pool in the roll nip of secondary cooling zone in continuous slab caster: application of open channel hydraulics
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article
Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses
Abstract
<jats:p>In this study, the evolution of mechanical properties, microstructure, and residual stresses during selective laser melting of CuSn10 components was studied. To provide a proper material model for the simulations, various CuSn10 parts were manufactured using selective laser melting and examined. The manufactured parts were also used to validate the developed model. Subsequently, a sequentially coupled thermal–mechanical FEM model was developed using the Ansys software package. The developed model was able to deliver the mechanical properties, residual stresses, and microstructure of the additively manufactured components. Due to introducing some simplifications to the model, a calibration factor was applied to adjust the simulation results. However, the developed model was validated and showed a good agreement with the experimental results, such as measured residual stresses using the hole drilling method, as well as mechanical properties of manufactured parts. Moreover, the developed material model was used to simulate the microstructure of manufactured CuSn10. A fine-grain microstructure with an average diameter of 19 ± 11 μm and preferred orientation in the Z-direction, which was the assembly direction, was obtained.</jats:p>