| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vizureanu, Petrica
Isaac Newton Group
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2023Computer simulations of end-tapering anchorages of EBR FRP-strengthened prestressed concrete slabs at service conditionscitations
- 2023Effect of the Sintering Mechanism on the Crystallization Kinetics of Geopolymer-Based Ceramicscitations
- 2023Effect of Sintering Mechanism towards Crystallization of Geopolymer Ceramic—A Reviewcitations
- 2022Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Reviewcitations
- 2022Experimental Research on New Developed Titanium Alloys for Biomedical Applicationscitations
- 2022Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cellcitations
- 2022Mechanical Characterization and In Vitro Assay of Biocompatible Titanium Alloyscitations
- 2021New Titanium Alloys, Promising Materials for Medical Devicescitations
- 2021Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealingcitations
- 2017Synthesis, Processing, and Characterization of the Cobalt Alloys with Silicon Additioncitations
- 2014Active Screen Plasma Nitriding Efficiency and Ecologycitations
Places of action
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article
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
Abstract
<jats:p>Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.</jats:p>