| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vizureanu, Petrica
Isaac Newton Group
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2023Computer simulations of end-tapering anchorages of EBR FRP-strengthened prestressed concrete slabs at service conditionscitations
- 2023Effect of the Sintering Mechanism on the Crystallization Kinetics of Geopolymer-Based Ceramicscitations
- 2023Effect of Sintering Mechanism towards Crystallization of Geopolymer Ceramic—A Reviewcitations
- 2022Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Reviewcitations
- 2022Experimental Research on New Developed Titanium Alloys for Biomedical Applicationscitations
- 2022Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cellcitations
- 2022Mechanical Characterization and In Vitro Assay of Biocompatible Titanium Alloyscitations
- 2021New Titanium Alloys, Promising Materials for Medical Devicescitations
- 2021Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealingcitations
- 2017Synthesis, Processing, and Characterization of the Cobalt Alloys with Silicon Additioncitations
- 2014Active Screen Plasma Nitriding Efficiency and Ecologycitations
Places of action
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article
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
Abstract
<jats:p>This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joints. Additionally, the synchrotron µX-ray fluorescence (XRF) method was adopted to precisely explore the elemental distribution in the joints. Results indicated that the Cu6Sn5 and Cu3Sn intermetallic layers thickness at the solder/Cu interface rises with annealing time at a rate of 0.042 µm/h for Sn-0.7Cu and 0.037 µm/h for Sn-0.7Cu-1.5Bi. The IMC growth’s activation energy during annealing is 48.96 kJ mol-1 for Sn-0.7Cu, while adding Bi into Sn-0.7Cu solder increased the activation energy to 55.76 kJ mol−1. The µ-XRF shows a lower Cu concentration level in Sn-0.7Cu-1.5Bi, where the Bi element was well dispersed in the β-Sn area as a result of the solid solution mechanism. The shape of the IMC layer also reconstructs from a scallop shape to a planar shape after the annealing process. The Sn-0.7Cu hardness and shear strength increased significantly with 1.5 wt.% Bi addition in reflowed and after isothermal annealing conditions.</jats:p>