Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2021Investigations on melt flow rate and tensile behaviour of single, double and triple sized copper reinforced thermo-plastic composites28citations

Places of action

Chart of shared publication
Scutaru, Maria Luminita
1 / 2 shared
Pruncu, Catalin I.
1 / 28 shared
Singh, Sunpreet
1 / 9 shared
Muntean, Radu
1 / 1 shared
Kumar, Raman
1 / 19 shared
Chohan, Jasgurpreet Singh
1 / 5 shared
Chart of publication period
2021

Co-Authors (by relevance)

  • Scutaru, Maria Luminita
  • Pruncu, Catalin I.
  • Singh, Sunpreet
  • Muntean, Radu
  • Kumar, Raman
  • Chohan, Jasgurpreet Singh
OrganizationsLocationPeople

article

Investigations on melt flow rate and tensile behaviour of single, double and triple sized copper reinforced thermo-plastic composites

  • Scutaru, Maria Luminita
  • Singh, Balwant
  • Pruncu, Catalin I.
  • Singh, Sunpreet
  • Muntean, Radu
  • Kumar, Raman
  • Chohan, Jasgurpreet Singh
Abstract

Thermoplastic composite materials are emerging rapidly due to the flexibility of attaining customized mechanical and melt flow properties. Due to high ductility, toughness, recyclability, and thermal and electrical conductivity, there is ample scope of using copper particles in thermoplastics for 3d printing applications. In the present study, an attempt was made to investigate the Melt Flow Index (MFI), tensile strength, and electrical and thermal conductivity of nylon 6 and ABS (acrylonitrile butadiene styrene) thermoplastics reinforced with copper particles. Thus, the experiments were conducted by adding different-sized copper particles (100 mesh, 200 mesh, and 400 mesh) in variable compositions (0% to 10%) to ABS and nylon 6 matrix. The impact of single, double, and triple particle-sized copper particles on MFI was experimentally investigated followed by FTIR and SEM analysis. Also, the tensile, electrical, and thermal conductivity testing were done on filament made by different compositions. In general, higher fluidity and mechanical strength were obtained while using smaller particles even with higher concentrations (upto 8%) due to improved bonding strength and adhesion between the molecular chains. Moreover, thermal and electrical conductivity was improved with an increase in concentration of copper particles.

Topics
  • impedance spectroscopy
  • scanning electron microscopy
  • experiment
  • melt
  • strength
  • composite
  • copper
  • tensile strength
  • thermoplastic
  • ductility
  • thermal conductivity
  • electrical conductivity