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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Zdunek, Krzysztof
Warsaw University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (15/15 displayed)
- 2021Synthesis of Copper Nitride Layers by the Pulsed Magnetron Sputtering Method Carried out under Various Operating Conditionscitations
- 2020Design of pulsed neon injection in the synthesis of W-B-C films using magnetron sputtering from a surface-sintered single powder cathodecitations
- 2020Surface sintering of tungsten powder targets designed by electromagnetic discharge: A novel approach for film synthesis in magnetron sputteringcitations
- 2019Plasmochemical investigations of DLC/WCx nanocomposite coatings synthesized by gas injection magnetron sputtering techniquecitations
- 2019Influence of annealing on electronic properties of thin AlN films deposited by magnetron sputtering method on silicon substratescitations
- 2018Relation between modulation frequency of electric power oscillation during pulse magnetron sputtering deposition of MoNx thin filmscitations
- 2018Phase composition of copper nitride coatings examined by the use of X-ray diffraction and Raman spectroscopycitations
- 2018Structure and electrical resistivity dependence of molybdenum thin films deposited by dc modulated pulsed magnetron sputteringcitations
- 2017Reactive sputtering of titanium compounds using the magnetron system with a grounded cathodecitations
- 2017Multi-sided metallization of textile fibres by using magnetron system with grounded cathodecitations
- 2016Determination of sp 3 fraction in ta-C coating using XPS and Raman spectroscopy
- 2016Titanium nitride coatings synthesized by IPD method with eliminated current oscillationscitations
- 2013Plasma etching of aluminum nitride thin films prepared by magnetron sputtering method
- 2010Structure of Fe-Cu coatings prepared by the magnetron sputtering method
- 2009Electric Characterization and Selective Etching of Aluminum Oxidecitations
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article
Synthesis of Copper Nitride Layers by the Pulsed Magnetron Sputtering Method Carried out under Various Operating Conditions
Abstract
<jats:p>Copper nitride shows various properties that depend on the structure of the material and is influenced by the change in technical parameters. In the present work, Cu–N layers were synthesized using the pulsed magnetron sputtering method. The synthesis was performed under different operating conditions: direct current (DC) or alternating current (AC) power supply, and various atmospheres: pure Ar and a mixture of Ar + N2. The structural properties of the deposited layers were characterized by X-ray diffraction measurements, and Raman spectroscopy and scanning electron microscopy have been performed. Optical properties were also evaluated. The obtained layers showed tightly packed columnar grain features. The kinetics of the layer growth in the AC mode was lower than that observed in the DC mode, and the layers were thinner and more fine-grained. The copper nitride layers were characterized by the one-phase and two-phase polycrystalline structure of the Cu3N phase with the preferred growth orientation (100). The lattice constant oscillates between 3.808 and 3.815 Å for one-phase and has a value of 3.828 Å for a two-phase structure. Phase composition results were correlated with Raman spectroscopy measurements. Raman spectra exhibited a broad, diffused, and intense signal of Cu3N phase, with Raman shift located at 628–635 cm−1. Studies on optical properties showed that the energy gap ranged from 2.17 to 2.47 eV. The results showed that controlling technical parameters gives a possibility to optimize the structure and phase composition of deposited layers. The reported changes were discussed and attributed to the properties of the material layers and technology method.</jats:p>