| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Zimmermann, André
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (17/17 displayed)
- 2024Dielectric properties of PEEK/PEI blends as substrate material in high-frequency circuit board applications
- 2023Analysis of tempering effects on LDS-MID and PCB substrates for HF applications
- 2023Direct processing of PVD hard coatings via focused ion beam milling for microinjection molding
- 2022Use of PtC nanotips for low-voltage quantum tunneling applications
- 2022Characterization of wire-bonding on LDS materials and HF-PCBs for high-frequency applications
- 2022Flexural Fatigue Test—A Proposed Method to Characterize the Lifetime of Conductor Tracks on Polymeric Substratescitations
- 2022Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterization
- 2022Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplasticscitations
- 2022Flexural fatigue test : a proposed method to characterize the lifetime of conductor tracks on polymeric substrates
- 2021Soft tooling-friendly inductive mold heating - a novel concept
- 2021Investigation of focused ion and electron beam platinum carbon nano-tips with transmission electron microscopy for quantum tunneling vacuum gap applications
- 2021Feasibility study of soft tooling inserts for injection molding with integrated automated slides
- 2021Development and proof of concept of a miniaturized MEMS quantum tunneling accelerometer cased on PtC tips by focused ion beam 3D nano-patterning
- 2020Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Moldingcitations
- 2020Reliability study of electronic components on board-level packages encapsulated by thermoset injection moldingcitations
- 2019Miniaturized Optical Encoder with Micro Structured Encoder Disccitations
- 2019An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packagescitations
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article
Reliability study of electronic components on board-level packages encapsulated by thermoset injection molding
Abstract
A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material intensifies the implementation of thermoset injection molding for the encapsulation process of board-level packages. Reliability case studies of such encapsulated electronic components as a part of board-level packages become, thereupon, necessary. This paper presents the reliability study of exemplary electronic components, surface-mounted on printed circuit boards (PCBs), encapsulated by the means of thermoset injection molding, and subjected to cyclic thermal loading. The characteristic lifetime of the electronic components is statistically calculated after assessing the probability plots and presented consequently. A few points of conclusion are summarized, and the future scope is discussed at the end.