• Dire, Sandra
• Parrino, Francesco
• Callone, Emanuela
• Fredi, Giulia
• Romeo, Chiara

Abstract

The miniaturization and high-power density of modern electronic devices pose significant thermal management issues, particularly affecting their performance and lifetime. Ladder-like polysilsesquioxanes (LPSQs) offer a promising solution due to their remarkable thermal, mechanical, and chemical properties. By incorporating thermally conductive fillers, LPSQ composites can achieve high thermal conductivity (TC), making them ideal for thermal management in advanced electronic applications. In this study, LPSQ-based nanocomposites containing functionalized alumina nanoparticles were prepared by solution casting and UV curing, and the effects of varying amounts of Irgacure-184 photoinitiator on their structural and thermal properties were investigated. Three sets of samples were prepared with a fixed amount of LPSQs, 80 wt.% of nanoparticles, and 1, 5, or 10 wt.% of photoinitiator with respect to the matrix. TC was evaluated from the measured values of heat capacity, density, and thermal diffusivity. TC values increased by 60%, 71.2%, and 93.1% for the three samples, respectively, compared to the neat matrix. Results indicate that an intermediate amount of photoinitiator (5%) preserved LPSQs' structural integrity, namely the presence of long linear silsesquioxane chains, and provided good filler dispersion and distribution, high polymerization degree, thermal stability, and high TC.

Topics

• nanoparticle
• nanocomposite
• density
• dispersion
• casting
• diffusivity
• ultraviolet curing
• thermal conductivity
• heat capacity