Materials Map

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Topics

Publications (1/1 displayed)

  • 2023Optimization and Prediction of Thermal Conductivity and Electrical Conductivity of Vacuum Sintered Ti-6Al-4V-SiC(15 Wt.%) Using Soft Computing Techniques3citations

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Hegde, Adithya
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Nayak, Madhukar
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Kumar, Mohan
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Shetty, Raviraj
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2023

Co-Authors (by relevance)

  • Hegde, Adithya
  • Nayak, Madhukar
  • Kumar, Mohan
  • Shetty, Raviraj
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article

Optimization and Prediction of Thermal Conductivity and Electrical Conductivity of Vacuum Sintered Ti-6Al-4V-SiC(15 Wt.%) Using Soft Computing Techniques

  • Hegde, Adithya
  • Nayak, Madhukar
  • Shanubhogue, Deepika
  • Kumar, Mohan
  • Shetty, Raviraj
Abstract

<jats:p>Titanium silicon carbide (Ti3SiC2) is a novel composite material that has found a multitude of uses in the aerodynamics, automobile, and marine industries due to its excellent properties such as high strength and modulus, high thermal and electrical conductivity, high melting point, excellent corrosion resistance, and high-temperature oxidation resistance. These properties are strongly associated with physical properties and microstructural features. Due to difficulties in the synthesis of this material, there have been very few investigations on the relationship between microstructure and physical characteristics of titanium silicon carbide composites processed through powder metallurgical process. However, the importance of thermal conductivity and electrical conductivity of titanium silicon carbide composites in various potential applications has led to keen attention from several researchers. Hence, in this paper, optimization, and prediction of process input parameters during processing under vacuum sintering for achieving maximum electrical and thermal conductivity of Ti-6Al-4V-SiC(15 Wt.%) has been presented. Using Taguchi’s L9 Orthogonal Array, it has been observed that aging temperature (1150 °C), aging time (four hours), heating rate (25 °C/min), and cooling rate (5 °C/min) result in optimum input parameters for achieving the highest electrical conductivity values during the processing of Ti-6Al-4V-SiCp composites. Further, for maximum thermal conductivity values during the processing of Ti-6Al-4V-SiCp composites, aging temperature (1150 °C), aging time (four hours), heating rate (5 °C/min), and cooling rate (5 °C/min) are preferred. A second-order response surface model generated can be effectively used for predicting the electrical conductivity and thermal conductivity during the processing of Ti-6Al-4V-SiCp composites with an accuracy of 99.28% (electrical conductivity) and 99.14% (thermal conductivity). By comparing the experimental results along with the results of the mathematical model and the BPANN model results for nine trials, it was observed that the estimated value is accurate for all tests with an error of 0.39% (electrical conductivity) and 0.48% (thermal conductivity). Further, from X-ray diffraction studies and microstructural analysis, it has been observed that aging at 1150 °C for four hours resulted in the formation of a ternary carbide phase of titanium silicon carbide (Ti3SiC2), which resulted in maximum electrical conductivity (4,260,000 Ω−1 m−1) and thermal conductivity (36.42 W/m·K) of the Ti-6Al-4V-SiC (15 Wt.%) composite specimen.</jats:p>

Topics
  • impedance spectroscopy
  • microstructure
  • surface
  • corrosion
  • phase
  • x-ray diffraction
  • strength
  • carbide
  • composite
  • Silicon
  • titanium
  • aging
  • thermal conductivity
  • electrical conductivity
  • sintering
  • aging