Materials Map

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (43/43 displayed)

  • 2024Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modelingcitations
  • 2024Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link1citations
  • 2023Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA2citations
  • 2023Electro-optical co-integration platform for high-density hybrid systems - SILHOUETTEcitations
  • 2023Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link1citations
  • 2023Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line1citations
  • 2023Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling3citations
  • 2023Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill3citations
  • 2023Characterization of Embedded and Thinned RF Chips1citations
  • 2023Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling3citations
  • 2023Feasibility and Optimisation of Cu-Sintering under Nitrogen Atmosphere1citations
  • 2022Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages3citations
  • 2022Embedding of Thinned RF Chips and Electrical Redistribution Layer Characterization1citations
  • 2022Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips3citations
  • 2022Development of a Ultra-Thin Glass Based Pressure Sensor for High-Temperature Applicationcitations
  • 2020Stereolithographic printed polymers on ceramic for 3D-opto-MID1citations
  • 2020Influence of flexibility of the interconnects on the dynamic bending reliability of flexible hybrid electronics12citations
  • 2019Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices4citations
  • 2019Analysis of flip-chip solder joints under isothermal vibration loading11citations
  • 2018Interconnect Technology Development for 180GHz Wireless mm-Wave System-in-Foil Transceivers7citations
  • 2018The future of short-range high-speed data transmission3citations
  • 2018Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?5citations
  • 2018Roll-to-roll processing of film substrates for hybrid integrated flexible electronics81citations
  • 2018Wire Bonding of Surface Acoustic Wave (SAW) Sensors for High Temperature Applications4citations
  • 2018Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible Application9citations
  • 2017Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly4citations
  • 2016A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foilscitations
  • 2016Screen printed conductive pastes for biomedical electronics4citations
  • 2015Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates8citations
  • 2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications3citations
  • 2014Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates12citations
  • 2014Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags10citations
  • 2013"Sensor-filter" - intelligent micro filter system in foil technologycitations
  • 2013Genotyping of single nucleotide polymorphisms by melting curve analysis using thin film semi-transparent heaters integrated in a lab-on-foil system19citations
  • 2013Foil-based DNA melting curve analysis platform for low-cost point-of-care molecular diagnosticscitations
  • 2012"Sensor-filter" - intelligent micro filter system in foil technologycitations
  • 2012DNA melting curve analysis on semi-transparent thin film microheater on flexible lab-on-foil substratecitations
  • 2011Ultra-thin wafer fabrication through dicing-by-thinning10citations
  • 2011Influence of wafer grinding and etching techniques on the fracture strength of thin silicon substrates3citations
  • 2010Rapid prototyping of electronic modules combining aerosol printing and ink jet printing6citations
  • 2010Electrical stress on film resistive structures on flexible substrates1citations
  • 2009Properties of conductive microstructures containing nano sized silver particles18citations
  • 2008Selective one-step plasma patterning process for fluidic self-assembly of silicon chips16citations

Places of action

Chart of shared publication
Dudash, Viktor
3 / 3 shared
Meier, Karsten
15 / 17 shared
Machani, Kashi Vishwanath
4 / 4 shared
Kuechenmeister, Frank
4 / 4 shared
Geisler, Holm
2 / 2 shared
Wieland, Marcel
4 / 4 shared
Mueller, Maik
2 / 12 shared
Nieweglowski, Krzysztof
10 / 10 shared
Mistry, Akash
2 / 2 shared
Yichen, Qi
1 / 1 shared
Albrecht, Oliver
1 / 1 shared
Höhne, Robert
2 / 2 shared
Lapteva, Margarita
1 / 1 shared
Catuneanu, Mircea-Traian
1 / 1 shared
Weyers, David
1 / 1 shared
Landwehr, Matthias
1 / 1 shared
Boenhardt, Sascha
1 / 1 shared
He, Menglong
1 / 1 shared
Vibhuti, Vinya
1 / 1 shared
Jamshidi, Kambiz
1 / 1 shared
Fell, Johann
1 / 1 shared
Hecker, Michael
1 / 2 shared
Muller, Maik
1 / 1 shared
Breuer, Dirk
1 / 1 shared
Singh, Prashant Kumar
1 / 3 shared
Lehmann, Marco
1 / 1 shared
Reim, Michael
1 / 1 shared
Morath, Helmuth
1 / 1 shared
Hoyer, Christian
1 / 1 shared
Ellinger, Frank
2 / 5 shared
Wagner, Jens
1 / 1 shared
Yin, Ran
4 / 4 shared
Boehme, Bjoern
1 / 1 shared
Capecchi, Simone
1 / 1 shared
Ok, Jungtae
1 / 1 shared
Gierth, Karl Felix Wendelin
1 / 1 shared
Meyer, Jörg
1 / 11 shared
Pechnig, Clara
1 / 1 shared
Reichel, Ludwig
1 / 1 shared
Esche, Maria
1 / 1 shared
Schulze, Robin
1 / 3 shared
Knoch, Philip
1 / 1 shared
Endisch, Christian
1 / 2 shared
Lorenz, Lukas
2 / 2 shared
Ackstaller, Thomas
2 / 2 shared
Palavesam, Nagarajan
5 / 5 shared
Landesberger, Christof
8 / 9 shared
Kutter, Christoph
4 / 7 shared
Hell, Waltraud
1 / 1 shared
Drost, Andreas
1 / 1 shared
Dasgupta, Abhijit
1 / 1 shared
Leslie, David
1 / 1 shared
Röllig, Mike
2 / 7 shared
Seiler, Patrick
1 / 4 shared
Lüngen, Sebastian
1 / 1 shared
Fritsche, David
1 / 1 shared
Carta, Corrado
1 / 1 shared
Plettemeier, Dirk
1 / 20 shared
Neermann, S.
1 / 2 shared
Franke, J.
1 / 5 shared
Reitberger, T.
1 / 3 shared
Overmeyer, L.
1 / 14 shared
Lorenz, L.
1 / 2 shared
Hoffmann, G. A.
1 / 1 shared
Wolter, K. J.
1 / 6 shared
Stoll, T.
1 / 2 shared
Tiedje, Tobias
1 / 1 shared
Lungen, Sebastian
1 / 1 shared
Marin, Sonia
1 / 1 shared
Hemmetzberger, Dieter
1 / 1 shared
Brachmann, Erik
1 / 2 shared
Ernst, Daniel
1 / 7 shared
Menzel, Siegfried
1 / 2 shared
Fritsch, Marco
1 / 12 shared
Rebohle, Lars
1 / 5 shared
Wang, Yakun
1 / 1 shared
Schubert, Martin
2 / 11 shared
Vinnichenko, Mykola
1 / 8 shared
Schumann, Thomas
1 / 1 shared
Metasch, René
1 / 4 shared
Friedrich, Sabine
1 / 1 shared
Berg, Hendrik
1 / 1 shared
Roellig, Mike
1 / 2 shared
Borner, K.
1 / 1 shared
Bose, I.
1 / 1 shared
Tetzner, K.
1 / 3 shared
Meixner, L.
1 / 1 shared
Rückerl, A.
1 / 1 shared
Alberti, M.
1 / 2 shared
Endres, H.-E.
1 / 1 shared
Eder, M.
1 / 13 shared
Zilio, Caterina
1 / 3 shared
Klink, Gerhard
1 / 1 shared
Chiari, Marcella
1 / 4 shared
Zelenin, Sergey
1 / 1 shared
Russom, Aman
1 / 5 shared
Hammerle, Tobias
1 / 1 shared
Ohlander, Anna
1 / 2 shared
Ramachandraiah, H.
1 / 1 shared
Ohlander, A.
2 / 2 shared
Russom, A.
2 / 2 shared
Bauer, S.
1 / 15 shared
Eder, Maximilian
1 / 1 shared
Endres, Hanns-Erik
1 / 3 shared
Rückerl, Andres
1 / 1 shared
Alberti, Martin
1 / 1 shared
Meixner, Leonhard
1 / 1 shared
Zilio, C.
1 / 2 shared
Hammerle, T.
1 / 1 shared
Damin, F.
1 / 7 shared
Chiari, M.
1 / 10 shared
Klink, G.
2 / 5 shared
Scherbaum, Sabine
2 / 3 shared
Paschke, Christoph
1 / 1 shared
Gieser, H. A.
1 / 1 shared
Milosiu, H.
1 / 1 shared
Hengelmann, H.
1 / 1 shared
Curran, B.
1 / 1 shared
Oehler, F.
1 / 9 shared
Wolf, H.
1 / 1 shared
Bahr, J.
1 / 2 shared
Domann, G.
1 / 5 shared
Werner, C.
1 / 8 shared
Ndip, I.
1 / 3 shared
Zollmer, V.
1 / 1 shared
Bonfert, D.
2 / 3 shared
Gieser, H.
1 / 1 shared
Svasta, P.
1 / 2 shared
Ionescu, C.
1 / 3 shared
Nitsch, Karol
1 / 1 shared
Felba, Jan
1 / 1 shared
Tesarski, Sebastian
1 / 1 shared
Kinart, Andrzej
1 / 1 shared
Moscicki, Andrzej
1 / 1 shared
Bonfert, Detlef
1 / 1 shared
Piasecki, Tomasz
1 / 2 shared
Yacoub-George, Erwin
1 / 2 shared
Chart of publication period
2024
2023
2022
2020
2019
2018
2017
2016
2015
2014
2013
2012
2011
2010
2009
2008

Co-Authors (by relevance)

  • Dudash, Viktor
  • Meier, Karsten
  • Machani, Kashi Vishwanath
  • Kuechenmeister, Frank
  • Geisler, Holm
  • Wieland, Marcel
  • Mueller, Maik
  • Nieweglowski, Krzysztof
  • Mistry, Akash
  • Yichen, Qi
  • Albrecht, Oliver
  • Höhne, Robert
  • Lapteva, Margarita
  • Catuneanu, Mircea-Traian
  • Weyers, David
  • Landwehr, Matthias
  • Boenhardt, Sascha
  • He, Menglong
  • Vibhuti, Vinya
  • Jamshidi, Kambiz
  • Fell, Johann
  • Hecker, Michael
  • Muller, Maik
  • Breuer, Dirk
  • Singh, Prashant Kumar
  • Lehmann, Marco
  • Reim, Michael
  • Morath, Helmuth
  • Hoyer, Christian
  • Ellinger, Frank
  • Wagner, Jens
  • Yin, Ran
  • Boehme, Bjoern
  • Capecchi, Simone
  • Ok, Jungtae
  • Gierth, Karl Felix Wendelin
  • Meyer, Jörg
  • Pechnig, Clara
  • Reichel, Ludwig
  • Esche, Maria
  • Schulze, Robin
  • Knoch, Philip
  • Endisch, Christian
  • Lorenz, Lukas
  • Ackstaller, Thomas
  • Palavesam, Nagarajan
  • Landesberger, Christof
  • Kutter, Christoph
  • Hell, Waltraud
  • Drost, Andreas
  • Dasgupta, Abhijit
  • Leslie, David
  • Röllig, Mike
  • Seiler, Patrick
  • Lüngen, Sebastian
  • Fritsche, David
  • Carta, Corrado
  • Plettemeier, Dirk
  • Neermann, S.
  • Franke, J.
  • Reitberger, T.
  • Overmeyer, L.
  • Lorenz, L.
  • Hoffmann, G. A.
  • Wolter, K. J.
  • Stoll, T.
  • Tiedje, Tobias
  • Lungen, Sebastian
  • Marin, Sonia
  • Hemmetzberger, Dieter
  • Brachmann, Erik
  • Ernst, Daniel
  • Menzel, Siegfried
  • Fritsch, Marco
  • Rebohle, Lars
  • Wang, Yakun
  • Schubert, Martin
  • Vinnichenko, Mykola
  • Schumann, Thomas
  • Metasch, René
  • Friedrich, Sabine
  • Berg, Hendrik
  • Roellig, Mike
  • Borner, K.
  • Bose, I.
  • Tetzner, K.
  • Meixner, L.
  • Rückerl, A.
  • Alberti, M.
  • Endres, H.-E.
  • Eder, M.
  • Zilio, Caterina
  • Klink, Gerhard
  • Chiari, Marcella
  • Zelenin, Sergey
  • Russom, Aman
  • Hammerle, Tobias
  • Ohlander, Anna
  • Ramachandraiah, H.
  • Ohlander, A.
  • Russom, A.
  • Bauer, S.
  • Eder, Maximilian
  • Endres, Hanns-Erik
  • Rückerl, Andres
  • Alberti, Martin
  • Meixner, Leonhard
  • Zilio, C.
  • Hammerle, T.
  • Damin, F.
  • Chiari, M.
  • Klink, G.
  • Scherbaum, Sabine
  • Paschke, Christoph
  • Gieser, H. A.
  • Milosiu, H.
  • Hengelmann, H.
  • Curran, B.
  • Oehler, F.
  • Wolf, H.
  • Bahr, J.
  • Domann, G.
  • Werner, C.
  • Ndip, I.
  • Zollmer, V.
  • Bonfert, D.
  • Gieser, H.
  • Svasta, P.
  • Ionescu, C.
  • Nitsch, Karol
  • Felba, Jan
  • Tesarski, Sebastian
  • Kinart, Andrzej
  • Moscicki, Andrzej
  • Bonfert, Detlef
  • Piasecki, Tomasz
  • Yacoub-George, Erwin
OrganizationsLocationPeople

article

Influence of flexibility of the interconnects on the dynamic bending reliability of flexible hybrid electronics

  • Palavesam, Nagarajan
  • Landesberger, Christof
  • Kutter, Christoph
  • Bock, Karlheinz
  • Hell, Waltraud
  • Drost, Andreas
Abstract

<p>The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potential to deliver high performance electrical functionalities at very low power requirements while being mechanically flexible. However, only very limited information is available regarding the fatigue or dynamic bending reliability of such chip-foil packages. This paper reports a series of experiments where the influence of the type of metal constituting the interconnects on the foil substrates on their dynamic bending reliability has been analyzed. The test results show that chip-foil packages with interconnects fabricated from a highly flexible metal like gold endure the repeated bending tests better than chip-foil packages with stiffer interconnects fabricated from copper or aluminum. We conclude that further analysis work in this field will lead to new technical concepts and designs for reliable foil based electronics.</p>

Topics
  • impedance spectroscopy
  • experiment
  • aluminium
  • gold
  • fatigue
  • copper
  • bending flexural test
  • Silicon
  • ion chromatography