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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Malchère, Annie
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Publications (5/5 displayed)
- 2022Dewetting of Ni silicide thin film on Si substrate: In-situ experimental study and phase-field modelingcitations
- 2022Toughening mechanisms in nacre-like alumina revealed by in-situ imaging of stresscitations
- 2020Effect of Thermal Stresses Formed during Air Annealing of Amorphous Lanthanum Cuprate Thin Films Deposited on Silicon Substratecitations
- 2019Fracture resistance of Ti-Ag thin films deposited on polymeric substrates for biosignal acquisition applicationscitations
- 2019Fracture resistance of Ti-Ag thin films deposited on polymeric substrates for biosignal acquisition applicationscitations
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article
Effect of Thermal Stresses Formed during Air Annealing of Amorphous Lanthanum Cuprate Thin Films Deposited on Silicon Substrate
Abstract
International audience ; Amorphous thin films of La-Cu-O deposited by magnetron sputtering have been annealed at different temperatures and in situ analyzed by X-ray diffraction. These experiments were useful to determine the crystallization temperature and to follow the crystallization process of the film. The in situ annealing X-ray diffraction analyses have been also used to determine the thermal expansion coefficient of La2CuO4 thin film. The estimated value is close to that obtained for a commercial powder. The thermal expansion coefficient value with additional environmental scanning electron microscopy observations explains the delamination origin that occurs during the annealing before the crystallization step. The buckling and delamination of the film observed is caused by the thermal expansion coefficient mismatch of the film and the substrate. During the heating step, the mismatch generates compressive stress at the film/substrate interface, causing the film to lift off and crack in the typical way.