| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Zimmermann, André
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (17/17 displayed)
- 2024Dielectric properties of PEEK/PEI blends as substrate material in high-frequency circuit board applications
- 2023Analysis of tempering effects on LDS-MID and PCB substrates for HF applications
- 2023Direct processing of PVD hard coatings via focused ion beam milling for microinjection molding
- 2022Use of PtC nanotips for low-voltage quantum tunneling applications
- 2022Characterization of wire-bonding on LDS materials and HF-PCBs for high-frequency applications
- 2022Flexural Fatigue Test—A Proposed Method to Characterize the Lifetime of Conductor Tracks on Polymeric Substratescitations
- 2022Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterization
- 2022Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplasticscitations
- 2022Flexural fatigue test : a proposed method to characterize the lifetime of conductor tracks on polymeric substrates
- 2021Soft tooling-friendly inductive mold heating - a novel concept
- 2021Investigation of focused ion and electron beam platinum carbon nano-tips with transmission electron microscopy for quantum tunneling vacuum gap applications
- 2021Feasibility study of soft tooling inserts for injection molding with integrated automated slides
- 2021Development and proof of concept of a miniaturized MEMS quantum tunneling accelerometer cased on PtC tips by focused ion beam 3D nano-patterning
- 2020Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Moldingcitations
- 2020Reliability study of electronic components on board-level packages encapsulated by thermoset injection moldingcitations
- 2019Miniaturized Optical Encoder with Micro Structured Encoder Disccitations
- 2019An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packagescitations
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article
Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding
Abstract
<jats:p>Thermoset materials offer a multitude of advantageous properties in terms of shrinkage and warpage as well as mechanical, thermal and chemical stability compared to thermoplastic materials. Thanks to these properties, thermosets are commonly used to encapsulate electronic components on a 2nd-level packaging prior to assembly by reflow soldering on printed circuits boards or other substrates. Based on the characteristics of thermosets to develop a distinct skin effect due to segregation during the molding process, the surface properties of injection molded thermoset components resemble optical characteristics. Within this study, molding parameters for thermoset components are analyzed in order to optimize the surface quality of injection molded thermoset components. Perspectively, in combination with a reflective coating by e.g., physical vapor deposition, such elements with micro-integrated reflective optical features can be used as optoelectronic components, which can be processed at medium-ranged temperatures up to 230 °C. The obtained results indicate the general feasibility since Ra values of 60 nm and below can be achieved. The main influencing parameters on surface quality were identified as the composition of filler materials and tool temperature.</jats:p>