• Yoo, Bongyoung
• Seo, Jinmyeong
• Lim, Jae-Hong
• Park, Jungjoon

Abstract

<jats:p>Intermetallic copper telluride thin films, which are important in a number of electronics fields, were electrodeposited using a potentiostatic method in low-pH aqueous electrolyte baths with various ion-source concentrations, and the electrical properties of the formed films were investigated after exfoliation from the substrate. The films were electrochemically analyzed by cyclic voltammetry, while surface and cross-sectional morphologies, compositional ratios, and electrical properties were analyzed by scanning electron microscopy, X-ray diffractometry, X-ray photoelectron spectroscopy, ultraviolet photoelectron spectroscopy, and Hall-effect experiments. The copper telluride thin films, which were synthesized at various potentials in each bath, exhibit different composition ratios and structures; consequently, they show a variety of electrical and thermoelectric properties, including different electrical conductivities, carrier concentrations, mobilities, and Seebeck coefficients. Among them, the thin film with a 1:1 Cu:Te ratio delivered the highest power factor due to carrier filtering at the interface between the two phases.</jats:p>

Topics

• surface
• phase
• scanning electron microscopy
• experiment
• thin film
• x-ray photoelectron spectroscopy
• copper
• intermetallic
• electrodeposition
• cyclic voltammetry
• ultraviolet photoelectron spectroscopy