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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Verdingovas, Vadimas
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2020Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloyscitations
- 2019Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loadscitations
- 2018Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activatorscitations
- 2018Corrosion Reliability of Lead-Free Solder Systems Used in Electronicscitations
- 2017Corrosion reliability of lead-free solder systems used in electronicscitations
- 2015Effect of iodine on the corrosion of Au-Al wire bondscitations
- 2014Corrosion in electronics: Overview of failures and countermeasures
- 2013Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics
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document
Corrosion Reliability of Lead-Free Solder Systems Used in Electronics
Abstract
The present work investigated the corrosion reliability of five Sn-Ag-Cu (SAC) based lead-free solder alloys. The first focus was placed on microstructural analysis of the intermetallic compounds (IMCs) formation in the ingots of SAC alloys and their influence on micro galvanic corrosion performance. The microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and Xray diffraction (XRD) methods. With the potentiostatic technique, the galvanic corrosion has been confirmed between cathodically active Bi phase and anodic (Sn, Sb) solid solution in InnoLot alloy, while the Ag3Sn phase was cathodically active in the other four alloys. In industrial application point of view, the electrochemical migration (ECM) has been reported as the critical issue. Therefore, in order to investigate the ECM susceptibility of five lead-free solder alloys, the study of the solder alloys has been conducted by water droplet (WD) tests on pure alloy ingot samples, and by accelerated humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. A ranking of susceptibility for five alloys has been confirmed by Weibull analysis (63.2% failure rate), leakage current level, and chargetransfer over time. The paper theoretically illustrated the reason for the differences in corrosion reliability in the five alloys based on the composition and distribution of IMCs.