| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Hoyer, Christian
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (1/1 displayed)
Places of action
| Organizations | Location | People |
|---|
document
Characterization of Embedded and Thinned RF Chips
Abstract
This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (G-CPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 µm to 20 µm, Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fan-out copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semi-additive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation.