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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Tiwary, Nikhilendu
Aalto University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2024Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
- 2024Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Testcitations
- 2023Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICscitations
- 2023Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °Ccitations
- 2022Finite element simulation of solid-liquid interdiffusion bonding process: Understanding process dependent thermomechanical stresscitations
- 2022Finite element simulation of solid-liquid interdiffusion bonding processcitations
- 2021Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bondscitations
- 2021Low-temperature Metal Bonding for Optical Device Packagingcitations
- 2015Spin-coatable, photopatternable magnetic nanocomposite thin films for MEMS device applicationscitations
Places of action
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conferencepaper
Low-temperature Metal Bonding for Optical Device Packaging
Abstract
Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient of thermal expansion (CTE) at elevated temperatures. This work applied the Cu-Sn-In-based SLID bonding method to bond silicon and optically transparent materials at 200 °C. Experimental results show a successful bonding with minor unavoidable misalignment from the CTE mismatch and major misalignment from the bonding alignment process. Microstructural analysis shows the intermetallic compound consists only of Cu6(Sn,In)5 on the bond that is thermally stable up to 600 °C ; Peer reviewed