| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Zybała, Rafał
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2024Mg nanostructures with controlled dominant c-plane or m-plane facets by DC magnetron sputter depositioncitations
- 2024Using SPS Sintering System in Fabrication of Advanced Semiconductor Materials
- 2023Microstructural Evolution of Ni-SiC Composites Manufactured by Spark Plasma Sinteringcitations
- 2021Review of rapid fabrication methods of skutterudite materialscitations
- 2019Microstructure and thermoelectric properties of p and n type doped β-FeSi2 fabricated by mechanical alloying and pulse plasma sinteringcitations
- 2018Skutterudite (CoSb3) thermoelectric nanomaterials fabricated by Pulse Plasma in Liquidcitations
- 2017Effect of metallic coating on the properties of copper-silicon carbide compositescitations
- 2017Synthesis and characterization of antimony telluride for thermoelectric And optoelectronic applicationscitations
- 2017Microstructure and Thermal Properties of Cu-SiC Composite Materials Depending on the Sintering Techniquecitations
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article
Microstructure and Thermal Properties of Cu-SiC Composite Materials Depending on the Sintering Technique
Abstract
The presented paper investigates the relationship between the microstructure and thermal properties of copper–silicon carbide composites obtained through hot pressing (HP) and spark plasma sintering (SPS) techniques. The microstructural analysis showed a better densification in the case of composites sintered in the SPS process. TEM investigations revealed the presence of silicon in the area of metallic matrix in the region close to metal-ceramic boundary. It is the product of silicon dissolving process in copper occurring at an elevated temperature. The Cu-SiC interface is significantly defected in composites obtained through the hot pressing method, which has a major influence on the thermal conductivity of materials.