| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Nosewicz, Szymon
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2023Microstructural Evolution of Ni-SiC Composites Manufactured by Spark Plasma Sinteringcitations
- 2022Numerical Simulation of Thermal Conductivity and Thermal Stress in Lightweight Refractory Concrete with Cenospherescitations
- 2020Size Effects of Hardness and Strain Rate Sensitivity in Amorphous Silicon Measured by Nanoindentationcitations
- 2020Influence of overstoichiometric boron and titanium addition on the properties of RF magnetron sputtered tungsten boridescitations
- 2019Experimental and numerical studies of micro- and macromechanical properties of modified copper–silicon carbide compositescitations
- 2019Analysis of the micromechanical properties of copper-silicon carbide composites using nanoindentation measurementscitations
- 2019Effect of spark plasma sintering and high-pressure torsion on the microstructural and mechanical properties of a Cu–SiC compositecitations
- 2017Effect of metallic coating on the properties of copper-silicon carbide compositescitations
- 2017Investigations of interface properties in copper-silicon carbide compositescitations
- 2017Microstructure and Thermal Properties of Cu-SiC Composite Materials Depending on the Sintering Techniquecitations
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article
Microstructure and Thermal Properties of Cu-SiC Composite Materials Depending on the Sintering Technique
Abstract
The presented paper investigates the relationship between the microstructure and thermal properties of copper–silicon carbide composites obtained through hot pressing (HP) and spark plasma sintering (SPS) techniques. The microstructural analysis showed a better densification in the case of composites sintered in the SPS process. TEM investigations revealed the presence of silicon in the area of metallic matrix in the region close to metal-ceramic boundary. It is the product of silicon dissolving process in copper occurring at an elevated temperature. The Cu-SiC interface is significantly defected in composites obtained through the hot pressing method, which has a major influence on the thermal conductivity of materials.