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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Mendes, P. M.
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Topics
Publications (18/18 displayed)
- 2023A Multifunctional Cementitious Composite for Pavement Subgrade
- 2022A novel approach for micro-antenna fabrication on ZrO2 substrate assisted by laser printing for smart implantscitations
- 2014Piezoelectric actuators for acoustic mixing in microfluidic devices - Numerical prediction and experimental validation of heat and mass transportcitations
- 2014Polymer-based acoustic streaming for improving mixing and reaction times in microfluidic applicationscitations
- 2012Development of a piezoelectric transducers system to improve mixing of fluids
- 2011Large area microfabrication of electroactive polymeric structures based on near-field electrospinningcitations
- 2011A low-power/low-voltage CMOS wireless interface at 5.7 GHz with dry electrodes for cognitive networkscitations
- 2010Hydrogel-based photonic sensor for a biopotential wearable recording systemcitations
- 2009Wearable brain cap with contactless electroencephalogram measurement for brain-computer interface applicationscitations
- 2009Manufacturing technology for flexible optical sensing foilscitations
- 2007Reconfigurable on-chip folded-patch antenna using tunable electroactive materialscitations
- 2007Study on pulsed DC-sputtering of iridium oxide for implantable electrodes
- 2006Integrated chip-size antennas for wireless microsystems : fabrication and design Considerationscitations
- 2004Wafer-level packaging fo RF applications : using high resistivity polycrystalline silicon substrate technology
- 2003Integrated chip-size antenna for wireless microsystems : fabrication and design considerations
- 2003Extraction of glass-wafers electrical properties based on S-parameters measurements of coplanar waveguides
- 2003Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
- 2003Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages
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document
A Multifunctional Cementitious Composite for Pavement Subgrade
Abstract
<jats:p>Premature failure and degradation of layers are the main problems for transportation infrastruc-ture. Addressing these issues necessitates implementing structural health monitoring (SHM) for transportation layers. This strategic approach is instrumental in mitigating maintenance expenses, prolonging the operational lifespan, and preventing accidents resulting from abrupt layer col-lapse. To this end, this research investigated the stress/strain and damage detection capabilities of a self-sensing cementitious composite developed for potential utilization in the construction of an intelligent subgrade layer. The prepared self-sensing cementitious composite consisted of 10% cement and hybrid conductive fillers, including multiwalled carbon nanotubes (MWCNTs) and graphene nanoplatelets (GNPs) in sand. Initial findings reveal that the electrical resistivity of the composite is significantly affected by the concentration of MWCNTs/GNPs, with a minimum concentration of more than 0.5% needed to achieve a responsive cementitious composite. More-over, the piezoresistive analysis indicates that an increase in the concentration of MWCNTs/GNPs and stress levels leads to an improvement in the stress/strain sensing perfor-mance. When the self-sensing cementitious composite is subjected to equivalent stress levels, variations in the FCR exhibit an increasing trend with decreasing resilient modulus, stemming from a decrease in stiffness due to the increased concentration of MWCNTs/GNPs. Additionally, the EIS analysis demonstrates a contraction for the Nyquist curves under compressive ramp loading prior to failure, followed by the expansion of these curves postfailure. Scanning electron microscopy (SEM) images visually showcase the bridging effects of MWCNTs and the filling ef-fects of GNPs within the composite structure.</jats:p>