Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Zhang, Jie

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University of Bristol

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (7/7 displayed)

  • 2022Sizing limitations of ultrasonic array images for non-sharp defects and their impact on structural integrity assessments3citations
  • 2020Data fusion of multi-view ultrasonic imaging for characterisation of large defects31citations
  • 2020Effect of crack-like defects on the fracture behaviour of Wire + Arc additively manufactured nickel-base Alloy 71876citations
  • 2012Monte Carlo inversion of ultrasonic array data to map anisotropic weld properties30citations
  • 2012Autofocus imagingcitations
  • 2010Ultrasonic condition monitoring using thin-film piezoelectric sensors11citations
  • 2006Monitoring of lubricant film failure in a ball bearing using ultrasound63citations

Places of action

Chart of shared publication
Bhat, Shivaprasad Shridhara
1 / 1 shared
Larrosa, Nicolas O.
1 / 21 shared
Bevan, Rhodri L. T.
1 / 1 shared
Budyn, Nicolas
1 / 1 shared
Kitazawa, So
1 / 1 shared
Croxford, Anthony J.
1 / 9 shared
Wilcox, Pd
3 / 20 shared
Coules, Harry E.
1 / 17 shared
Ding, Jialuo
1 / 39 shared
Williams, Stewart W.
1 / 33 shared
Jones, Cp
1 / 11 shared
Seow, Cui Er
1 / 2 shared
Wu, Guiyi
1 / 1 shared
Drinkwater, Bw
4 / 25 shared
Hunter, Alan J.
1 / 2 shared
Hunter, A.
1 / 5 shared
Hutson, D.
1 / 4 shared
Elgoyhen, J.
1 / 1 shared
Hood, Jp
1 / 1 shared
Kirk, Kj
1 / 1 shared
Dwyer-Joyce, Rs
2 / 3 shared
Chart of publication period
2022
2020
2012
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Co-Authors (by relevance)

  • Bhat, Shivaprasad Shridhara
  • Larrosa, Nicolas O.
  • Bevan, Rhodri L. T.
  • Budyn, Nicolas
  • Kitazawa, So
  • Croxford, Anthony J.
  • Wilcox, Pd
  • Coules, Harry E.
  • Ding, Jialuo
  • Williams, Stewart W.
  • Jones, Cp
  • Seow, Cui Er
  • Wu, Guiyi
  • Drinkwater, Bw
  • Hunter, Alan J.
  • Hunter, A.
  • Hutson, D.
  • Elgoyhen, J.
  • Hood, Jp
  • Kirk, Kj
  • Dwyer-Joyce, Rs
OrganizationsLocationPeople

article

Ultrasonic condition monitoring using thin-film piezoelectric sensors

  • Drinkwater, Bw
  • Hutson, D.
  • Elgoyhen, J.
  • Hood, Jp
  • Kirk, Kj
  • Dwyer-Joyce, Rs
  • Zhang, Jie
Abstract

Thin-film low-profile sensors have been investigated for ultrasonic condition monitoring. The sensors are made by growing a thin film of aluminium nitride onto the component to be monitored. The transducers can be engineered to operate in passive or active mode from 200 kHz to 400 MHz. New or existing applications based on ultrasonic pulse-echo techniques or acoustic emission testing can make use of the sensors, including monitoring of high-temperature plant or machinery. The sensors have been demonstrated on various component materials such as stainless steel, ferritic steel, aluminium, titanium and silicon carbide. The piezoelectric material used, aluminium nitride, has a very high Curie temperature so the devices can be used up to 600°C. Examples are presented of devices operating in pulse-echo and passive detection modes, which could be used for permanent monitoring of parts which would normally require maintenance outage in order to be inspected. In addition, because the typical thin-film transducers are only 8-40 μm thick, sensors can be placed in locations previously impossible to access. The operating frequency of the thin-film devices has been investigated by simulation using an equivalent circuit model.

Topics
  • stainless steel
  • thin film
  • simulation
  • aluminium
  • nitride
  • carbide
  • Silicon
  • ultrasonic
  • titanium
  • acoustic emission
  • Curie temperature
  • piezoelectric material