| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Bossuyt, Frederick
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2023Methods to improve accuracy of electronic component positioning in thermoformed electronicscitations
- 2022Innovative component positioning method for thermoformed electronicscitations
- 2022A study on over-molded copper-based flexible electronic circuitscitations
- 2020Flexible microsystems using over-molding technologycitations
- 2020Solar cells integration in over-molded printed electronicscitations
- 2019Effect of overmolding process on the integrity of electronic circuitscitations
- 2017Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymerscitations
- 2016One-time deformable thermoplastic devices based on flexible circuit board technologycitations
- 2015Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)
- 20152.5D smart objects using thermoplastic stretchable interconnectscitations
- 2015Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
- 2013Stretchable electronics technology for large area applications: fabrication and mechanical characterizationcitations
- 2011The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnectscitations
Places of action
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document
Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)
Abstract
Fibre Reinforced Polymer (FRP) is becoming a valid alternative to many traditional heavy metal industries because of its high specific stiffness over the more classical construction metals. Recent trend of more complex geometry of composites is causing increasing difficulty in composite manufacturing. A method to optimize the manufacturing process is thus imposed to ensure and improve the quality of manufactured parts. Because of the irregular 3D shapes of the composites, traditional flat sensor system is becoming unfavorable and nonpractical for monitoring purpose. In this work, the current development status of a deformable microsystem for in situ cure degree monitoring of a glass fibre reinforced plastic is presented. To accommodate the non-flat shape of the composites, the proposal is to interconnect non-deformable functional island, which contains the capacitive sensor for cure degree monitoring, with meander-shaped deformable interconnections. The developed sensor system is able to withstand the manufacturing process where change of pressure and internal strain, thus force exerted on the sensor system, is involved.