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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Dell, John
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Topics
Publications (20/20 displayed)
- 2017Large-Area MEMS Tunable Fabry-Perot Filters for Multi/Hyperspectral Infrared Imagingcitations
- 2016Preparation and characterization of cerium substituted bismuth dysprosium iron garnets for magneto-optic applicationscitations
- 2015Investigation of ICPECVD Silicon Nitride Films for HgCdTe Surface Passivationcitations
- 2014Characterization of mechanical, optical and structural properties of bismuth oxide thin films as a write-once medium for blue laser recordingcitations
- 2014Characterization of mechanical, optical and structural properties of bismuth oxide thin films as a write-once medium for blue laser recording
- 2014Investigation of cerium-substituted europium iron garnets deposited by biased target ion beam depositioncitations
- 2014GaSb: A new alternative substrate for epitaxial growth of HgCdTecitations
- 2011Thermally induced damages of PECVD SiNx thin filmscitations
- 2007Dielectric thin films for MEMS-based optical sensorscitations
- 2007Poisson's Ratio of Low-Temperature PECVD Silicon Nitride Thin Filmscitations
- 2007Process condition dependence of mechanical and physical properties of silicon nitride thin filmscitations
- 2006Thermal Stability of PECVD SiN/sub x/ Filmscitations
- 2006Effect of oxidation on the chemical bonding structure of PECVD SiN thin filmscitations
- 2006Stress in low-temperature plasma enhanced chemical vapour deposited silicon nitride thin filmscitations
- 2005Characterization of Mechanical Properties of Silicon Nitride Thin Films for MEMS Devices by Nanoindentation
- 2005Effects of deposition temperature on the mechanical and physical properties of silicon nitride thin filmscitations
- 2005Determination of mechanical properties of PECVD silicon nitride thin films for tunable MEMS Fabry-Perot optical filterscitations
- 2005Evaluation of Plasma Deposited Silicon Nitride Thin Flims for Microsystems Technologycitations
- 2004Laser-Beam-Induced Current Mapping of Spatial Nonuniformities in Molecular Beam Epitaxy As-Grown HgCdTecitations
- 2004Dark Currents in Long Wavelength Infrared HgCdTe Gated Photodiodescitations
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article
Thermally induced damages of PECVD SiNx thin films
Abstract
This study investigates thermally induced structural damages to amorphous plasma-enhanced chemical vapor deposition (PECVD) SiNx thin films at elevated temperatures, including chemical structure, microstructure, and physical integrity. The films were synthesized by means of PECVD method. Heating to elevated temperatures in air was found to cause multiple forms of chemical, structural, and physical damages. Chemically the films were found to oxidize and lose their nitrogen and hydrogen contents. Structurally the amorphous SiNx matrix was found to convert partially into SiO2 as a result of oxidation and to crystallize into Si3N4 crystallites. The physical damages include pinholes, circular "penny" cracks, random "dry mud" cracks, and spalling. The types of the damages were observed in different temperature regimes. The formation of the penny cracks is attributed to excessive compressive stresses created in the film by oxidation, which is associated with a large volume expansion. The formation of the random cracks is attributed to tensile stresses caused by crystallization, which is associated with a large volume contraction. Such damages limit the suitable application conditions for devices made of these films.