Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (5/5 displayed)

  • 2023Durability of Wood Exposed above Ground—Experience with the Bundle Test Method2citations
  • 2019Changes in sorption and electrical properties of wood caused by fungal decay21citations
  • 2019The Impact of Anatomical Characteristics on the Structural Integrity of Wood14citations
  • 2018Modeling the influence of thermal modification on the electrical conductivity of woodcitations
  • 2014Modeling the influence of thermal modification on the electrical conductivity of wood11citations

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Meyer-Veltrup, Linda
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Emmerich, Lukas
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Humar, Miha
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Alfredsen, Gry
1 / 5 shared
Sachse, Kathrin A.
1 / 2 shared
Welzbacher, Christian R.
1 / 2 shared
Chart of publication period
2023
2019
2018
2014

Co-Authors (by relevance)

  • Meyer-Veltrup, Linda
  • Emmerich, Lukas
  • Humar, Miha
  • Alfredsen, Gry
  • Sachse, Kathrin A.
  • Welzbacher, Christian R.
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document

Modeling the influence of thermal modification on the electrical conductivity of wood

  • Sachse, Kathrin A.
  • Brischke, Prof. Dr. Christian
  • Welzbacher, Christian R.
Abstract

A model has been developed aiming at the description of the effect of thermal modification on the electrical conductivity of wood. The intention was to calculate the moisture content (MC) of thermally modified timber (TMT) through the parameters electrical resistance R, wood temperature T, and CIE Lab color data, which are known to correlate well with the intensity of a heat treatment. Samples of Norway spruce (Picea abies Karst.) and beech (Fagus sylvatica L.) samples were thermally modified in laboratory scale at 11 different heat treatment intensities and the resistance characteristics of the samples were determined. Within the hygroscopic range, a linear relationship between the resistance characteristics and the mass loss (ML) through the heat treatment was established. Based on this, a model was developed to calculate MC from R, T, and ML. To validate this model, color values of 15 different TMTs from industrial production were determined for estimation of their ML and fed into the model. MC of the 15 arbitrarily heat-treated TMTs was calculated with an accuracy of ± 3.5% within the hygroscopic range. The material-specific resistance characteristics based on experimental data led to an accuracy of ± 2.5%. © 2014 Walter de Gruyter GmbH, Berlin/Boston.

Topics
  • wood
  • electrical conductivity