| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Stemme, Göran
KTH Royal Institute of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2018Through-Glass Vias for MEMS Packaging
- 2017Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprintcitations
- 2013Pt-Al2O3 dual layer atomic layer deposition coating in high aspect ratio nanoporescitations
- 2013Wafer-level integration of NiTi shape memory alloy on silicon using Au-Si eutectic bondingcitations
- 2013Unconventional applications of wire bonding create opportunities for microsystem integrationcitations
- 2012Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substratescitations
- 2012A low-power high-flow shape memory alloy wire gas microvalvecitations
- 2012Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wirescitations
- 2011Electrochemically Assisted Maskless Selective Removal of Metal Layers for Three-Dimensional Micromachined SOI RF MEMS Transmission Lines and Devicescitations
- 2011Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wirescitations
- 2011Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technologycitations
- 2010Design and wafer-level fabrication of SMA wire microactuators on siliconcitations
- 2009Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium-Nickel Sheets to Structured Silicon Waferscitations
- 2009FULL WAFER INTEGRATION OF SHAPE MEMORY ALLOY MICROACTUATORS USING ADHESIVE BONDINGcitations
Places of action
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article
Wafer-level hermetically sealed silicon photonic MEMS
Abstract
<jats:p>The emerging fields of silicon (Si) photonic micro–electromechanical systems (MEMS) and optomechanics enable a wide range of novel high-performance photonic devices with ultra-low power consumption, such as integrated optical MEMS phase shifters, tunable couplers, switches, and optomechanical resonators. In contrast to conventional <jats:inline-formula><mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" id="m1"><mml:mrow><mml:msub><mml:mrow><mml:mi>SiO</mml:mi></mml:mrow><mml:mn>2</mml:mn></mml:msub></mml:mrow></mml:math></jats:inline-formula>-clad Si photonics, photonic MEMS and optomechanics have suspended and movable parts that need to be protected from environmental influence and contamination during operation. Wafer-level hermetic sealing can be a cost-efficient solution, but Si photonic MEMS that are hermetically sealed inside cavities with optical and electrical feedthroughs have not been demonstrated to date, to our knowledge. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin caps featuring optical and electrical feedthroughs that connect the photonic MEMS on the inside to optical grating couplers and electrical bond pads on the outside. We used Si photonic MEMS devices built on foundry wafers from the iSiPP50G Si photonics platform of IMEC, Belgium. Vacuum confinement inside the sealed cavities was confirmed by an observed increase of the cutoff frequency of the electro-mechanical response of the encapsulated photonic MEMS phase shifters, due to reduction of air damping. The sealing caps are extremely thin, have a small footprint, and are compatible with subsequent flip-chip bonding onto interposers or printed circuit boards. Thus, our approach for sealing of integrated Si photonic MEMS clears a significant hurdle for their application in high-performance Si photonic circuits.</jats:p>