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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Low, C. T. J.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2016A review of developments in the electrodeposition of tincitations
- 2016Composite, multilayer and three-dimensional substrate supported tin-based electrodeposits from methanesulphonic acidcitations
- 2015Anodic deposition of compact, freely-standing or microporous polypyrrole films from aqueous methanesulphonic acidcitations
- 2014Electrodeposition of copper from mixed sulphate–chloride acidic electrolytes at rotating disc electrodecitations
- 2010Copper deposition at segmented, reticulated vitreous carbon cathode in hull cellcitations
- 2010Electrodeposition and tribological characterisation of nickel nanocomposite coatings reinforced with nanotubular titanatescitations
- 2010Developments in the soluble lead-acid flow batterycitations
- 2009Plasma electrolytic oxidation (PEO) for production of anodised coatings on lightweight metal (Al, Mg, Ti) alloyscitations
- 2008Normal and anomalous electrodeposition of tin–copper alloys from methanesulphonic acid bath containing perfluorinated cationic surfactantcitations
- 2006Electrodeposition of composite coatings containing nanoparticles in a metal depositcitations
Places of action
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article
Electrodeposition of copper from mixed sulphate–chloride acidic electrolytes at rotating disc electrode
Abstract
The effect of chloride ion on the deposition of copper from low metal concentrations in aqueous, acid sulphate solutions was investigated. The electrolytes contained 0·05 mol dm<sup>-3</sup> CuSO<sub>4</sub> and 0·5 mol dm<sup>-3</sup> Na<sub>2</sub>SO<sub>4</sub> at pH 2 and 296 K. The chloride ion concentration was varied in a wide range from 0·03 to 2·0 mol dm<sup>-3</sup>. Linear sweep voltammetry was carried out under well defined flow conditions at a smooth platinum rotating disc electrode. The progressive transition from a single, two-electron reaction for the reduction of Cu(II)?Cu(0) to two, single-electron reactions for the reduction sequence: Cu(II)→Cu(I)→Cu(0) was clearly evident as the chloride ion concentration increased. The charge transfer and mass transport characteristics of these reactions were evaluated. The formal potential for the Cu II) reduction to Cu(I), the shift in the potential region for complete mass transport controlled reduction of Cu(I) to Cu(0) and the potential for hydrogen evolution at the deposited copper were also studied. A semi-logarithmic relationship between exchange current density and half-wave potential for Cu(II)→Cu(I) with chloride ion was achieved when the Cl<sup>-</sup>/Cu(II) ratio in the electrolytes exceeded 2, due to the presence of the Cu(I) dichlorocuprous anion, CuCl<sub>2</sub><sup>-</sup>.