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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Petković, Branka
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Publications (5/5 displayed)
- 2024Elektrohemijska aktivnost perovskitskog oksida Ca0,9Er0,1MnO3 ; Electrochemical activity of perovskite oxide Ca0.9Er0.1MnO3
- 2022Cross-linked bio/inorganically modified urea-formaldehyde resins: Influence of γ-radiation on formaldehyde content
- 2021The effect of UV-irradiation on the thermal stability of modified urea-formaldehyde resins with thermally activated montmorillonite
- 2020Hydrolytic, thermal, and UV stability of urea‐formaldehyde resin/thermally activated montmorillonite nanocompositescitations
- 2016Nanosilica and wood flour-modified urea–formaldehyde compositescitations
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article
Nanosilica and wood flour-modified urea–formaldehyde composites
Abstract
<jats:p> In this study, the thermal behavior of modified urea–formaldehyde (UF) resin with nanosilica (nano-SiO<jats:sub>2</jats:sub>), wood flour (WF), and their mixture of SiO<jats:sub>2</jats:sub>/WF was investigated. Five modified UF hybrid composite materials with 0.8 F/U ratio with different filler were synthesized using the same procedure. The thermal behavior of materials was studied using nonisothermal thermogravimetric analysis, differential thermal gravimetry (DTG), and differential thermal analysis and supported by data from infrared spectroscopy. The shift of DTG peaks to a high temperature indicates the increase in thermal stability of modified UF resin with hybrid SiO<jats:sub>2</jats:sub>/WF fillers, which is confirmed by the data obtained from the Fourier transform infrared spectroscopic study. It was estimated that the UF/WF samples based on nano-SiO<jats:sub>2</jats:sub> have better thermal stability. </jats:p>