| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Green, Todd
University of Strathclyde
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloyscitations
- 2022Characteristics of anode materials for nickel electroformingcitations
- 2021Pulse electrodeposition of copper in the presence of a corrosion reactioncitations
- 2020Effect of water on the electrodeposition of copper from a deep eutectic solventcitations
- 2019Investigation of water absorption profile of mineral wool insulation
- 2018Anodic reactions and the corrosion of copper in deep eutectic solventscitations
- 2018Electrodeposition of Cu from a water-containing deep eutectic solvent
- 2017Pulse plating of copper from deep eutectic solventscitations
- 2017Electrodeposition of copper from deep eutectic solvents by using pulse current
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2012Pulse Plating
Places of action
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article
Anodic reactions and the corrosion of copper in deep eutectic solvents
Abstract
An analysis of the anodic reaction occurring at soluble copper anodes during the electrodeposition of copper from an ethaline-based deep eutectic solvent (DES) has been performed. It was shown by UV-Vis spectroscopy and electrochemical measurements that the dominant anodic species produced is the CuCl2- complex. In pure ethaline the current efficiency of the anodic process is 100% and the dissolution valency is one. However, in the presence of Cu(II) species the apparent dissolution valency measured gravimetrically was typically less than unity, corresponding to an observed mass loss greater than that expected from Faraday’s law. Moreover, the apparent dissolution valency showed a marked dependence on the electrode rotation rate, Cu(II) concentration and the water content of the deep eutectic solvent. These observations were consistent with a corrosion reaction occurring in parallel with anodic dissolution. The most likely corrosion process is the comproportionation reaction: 2CuCl2- CuCl42- + Cu. Voltammetric data indicate that the rate of this process is controlled by the mass transport of the CuCl42- complex to the surface and can readily explain the observed dissolution valency dependencies. Finally, it is noted that anomalous dissolution of Cu anodes in deep eutectic solvents makes their implementation as soluble anodes problematic.