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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Green, Todd
University of Strathclyde
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2023Influence of corrosion reactions on the pulse electrodeposition of metals and alloyscitations
- 2022Characteristics of anode materials for nickel electroformingcitations
- 2021Pulse electrodeposition of copper in the presence of a corrosion reactioncitations
- 2020Effect of water on the electrodeposition of copper from a deep eutectic solventcitations
- 2019Investigation of water absorption profile of mineral wool insulation
- 2018Anodic reactions and the corrosion of copper in deep eutectic solventscitations
- 2018Electrodeposition of Cu from a water-containing deep eutectic solvent
- 2017Pulse plating of copper from deep eutectic solventscitations
- 2017Electrodeposition of copper from deep eutectic solvents by using pulse current
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2017Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
- 2016Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodcitations
- 2012Pulse Plating
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article
Influence of corrosion reactions on the pulse electrodeposition of metals and alloys
Abstract
In the electrodeposition of metal and alloys by pulse plating, the importance of the pulse off-time is often neglected. Traditionally it is considered an electrochemically inactive period, allowing, for example, the relaxation of concentration gradients, desorption of additives, recrystallisation and discharge of the double layer capacitance. However, more recent studies have shown that it is possible to have corrosion processes occurring in the off-time which can significantly influence the deposit properties and current efficiency. This has been observed in both aqueous and non-aqueous systems, and appears a very general phenomenon. Typically, in these systems, corrosion is caused by dissolved oxygen or via comproportionation reactions. Similarly, during the pulse electrodeposition of binary and ternary alloys from aqueous and non-aqueous solutions, displacement (corrosion) reactions have been observed in the off-time that can alter the alloy composition and microstructure. The main aim of this paper is to review these various types of corrosion, establish the conditions under which they occur, and quantify their effects related to deposit characteristics, current efficiency and alloy composition.