| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Tatoulian, Michael
Chimie ParisTech
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (4/4 displayed)
- 2021On the adhesion of diamond-like carbon coatings deposited by low-pressure plasma on 316L stainless steelcitations
- 2020Modification of Surface Hydrophobicity of PLA/PE and ABS/PE Polymer Blends by ICP Etching and CFx Coatingcitations
- 2016Designing Hydrophobicity of the PLA Polymer Blend Surfaces by ICP Etchingcitations
- 2010MEMS Process by Film Transfer Using Fluorocarbon Anti-Adhesive Layer
Places of action
| Organizations | Location | People |
|---|
article
MEMS Process by Film Transfer Using Fluorocarbon Anti-Adhesive Layer
Abstract
<jats:p>A low cost and low temperature MEMS transfer process is presented. The process is based on adhesion control of molded electroplated Ni microstructures on donor wafer by using plasma deposited fluorocarbon film. Adhesive bonding of the microstructures on the target wafer using BCB sealing enables mechanical tearing out from the donor wafer. This proposed process has allowed us to realize from 7 µm down to 700 nm thick Ni patterns on Si, Pyrex glass wafers and Kapton foils. Multiple transfers lead to Ni stacked microstructures. Because this process is simple and only involves a low temperature (250°C) heating of the host wafer, it is highly versatile and suitable for various applications and brings new perspectives towards 3D integration of MEMS/NEMS.</jats:p>