Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (1/1 displayed)

  • 2015Status of light weight cassette design of SOFC14citations

Places of action

Chart of shared publication
Margaritis, N.
1 / 1 shared
Batfalsky, Peter
1 / 1 shared
Menzler, Norbert H.
1 / 10 shared
Federmann, Dirk
1 / 1 shared
Kroemer, Joachim
1 / 1 shared
Blum, Ludger
1 / 5 shared
Steinberger-Wilckens, Robert
1 / 38 shared
Peters, Roland
1 / 1 shared
Fang, Q.
1 / 5 shared
Chart of publication period
2015

Co-Authors (by relevance)

  • Margaritis, N.
  • Batfalsky, Peter
  • Menzler, Norbert H.
  • Federmann, Dirk
  • Kroemer, Joachim
  • Blum, Ludger
  • Steinberger-Wilckens, Robert
  • Peters, Roland
  • Fang, Q.
OrganizationsLocationPeople

article

Status of light weight cassette design of SOFC

  • Margaritis, N.
  • Batfalsky, Peter
  • Ceschini, Sergio
  • Menzler, Norbert H.
  • Federmann, Dirk
  • Kroemer, Joachim
  • Blum, Ludger
  • Steinberger-Wilckens, Robert
  • Peters, Roland
  • Fang, Q.
Abstract

Lightweight SOFC stacks are currently being developed especially for automotive applications such as APU and for portable devices. Within the EU funded project MMLCR=SOFC the Jülich lightweight so-called CS-design was improved concerning better suitability for glass sealing, reduced manufacturing effort and increased power. Based on modelling in combination with manufacturing experience, test results, and post-test analysis substantial changes of the previous CS-design were made. The manufacturing of single parts, particularly due to the improved design of sheet metal interconnects, as well as the assembling processes are suitable for low-cost mass manufacturing. The novel decal concept of glass-ceramic sealant screen printed on foil in order to produce green tapes is used for joining the stack layers offering an enormous potential for cost savings in industrial assembly process. First stack tests with the new CSV–design showed a comparable electrochemical performance to the previous CSIV design having at the same time a better thermo-mechanical behavior.

Topics
  • impedance spectroscopy
  • glass
  • glass
  • ceramic
  • joining