| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Liu, C.
Engineering and Physical Sciences Research Council
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (47/47 displayed)
- 2024Structure, processing and performance of ultra-high molecular weight polyethylene (IUPAC Technical Report). Part 2: crystallinity and supra molecular structurecitations
- 2024Structure, processing and performance of ultra-high molecular weight polyethylene (IUPAC Technical Report). Part 4: sporadic fatigue crack propagationcitations
- 2022Valence bond glass state in the 4d1 fcc antiferromagnet Ba2LuMoO6citations
- 2022Dynamic Recrystallization Behavior of Low-Carbon Steel during the Flexible Rolling Process: Modeling and Characterizationcitations
- 2022Valence bond glass state in the 4d 1 fcc antiferromagnet Ba 2 LuMoO 6
- 2022Integration of topological insulator josephson junctions in superconducting qubit circuits.citations
- 2021Valence bond glass state in the 4d1 fcc antiferromagnet Ba2LuMoO6
- 2021A Facile Method to Synthesize 3D Pomegranate-like Polydopamine Microspheres
- 2021Strain-dependent shear-band structure in a Zr-based bulk metallic glasscitations
- 2021Synergistic effects of crystalline microstructure, architected mesostructure, and processing defects on the mechanical behaviour of Ti6Al4V meta-crystalscitations
- 2020Microcrystalline cellulose as filler in polycaprolactone matrices
- 2020Structure, processing and performance of ultra-high molecular weight polyethylene (IUPAC Technical Report). Part 2: crystallinity and supra molecular structurecitations
- 2020Emergent magnetic phases in pressure tuned van-der-Waals antiferromagnet FePS3
- 2020Free-energy landscape of polymer-crystal polymorphismcitations
- 2020Multi-component chemo-mechanics based on transport relations for the chemical potentialcitations
- 2020Digital Twin-enabled Collaborative Data Management for Metal Additive Manufacturing Systemscitations
- 2019Novel semiconducting iron–quinizarin metal–organic framework for application in supercapacitors *
- 2019Damage-tolerant architected materials inspired by crystal microstructurecitations
- 2019Synthesis of epoxidized poly(ester carbonate)-b-polyimide-b-poly(ester carbonate): reactive single-walled carbon nanotube dispersants enable synergistic reinforcement around multi-walled nanotube-grafted carbon fiberscitations
- 2019Peptide-biofunctionalization of biomaterials for osteochondral tissue regeneration in early stage osteoarthritis: challenges and opportunitiescitations
- 2018Emergence of a quantum coherent state at the border of ferroelectricity
- 2018Damage-tolerant architected materials inspired by crystal microstructurecitations
- 2018Performance Enhancement of PEM Electrolyzers through Iridium-coated Titanium Porous Transport Layerscitations
- 2018Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusioncitations
- 2016CrCuAgN PVD nanocomposite coatings: Effects of annealing on coating morphology and nanostructurecitations
- 2016Determination of crystal growth rates during rapid solidification of polycrystalline aluminum by nano-scale spatio-temporal resolution in situ transmission electron microscopycitations
- 2016Micro- and nano-injectable composite biomaterials containing calcium phosphate coated with poly(DL-lactide-co-glycolide).citations
- 2015Low Temperature Resistivity of the Rare Earth Diborides (Er, Ho, Tm)B$_2$
- 2014Green, red and near-infrared photon up-conversion in Ga-Ge-Sb-S:Er.sup.3+./sup. amorphous chalcogenidescitations
- 2013A methodology to analyse and simulate mechanical characteristics of poly(2-hydroxyethyl methacrylate) hydrogelcitations
- 2013In-situ characterization of the damage evolution in thin polyelectrolyte films on TWIP steel substratescitations
- 2012Fluorescent and paramagnetic core-shell hybrid nanoparticles for bimodal magnetic resonance/luminescence imagingcitations
- 2012Fluorescent and paramagnetic core-shell hybrid nanoparticles for bimodal magnetic resonance/luminescence imagingcitations
- 2011New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidationcitations
- 2011Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bondscitations
- 2011Intermetallic phase transformations in Au-Al wire bondscitations
- 2010A micromechanism study of thermosonic gold wire bonding on aluminum padcitations
- 2009The potential of nano-structured silicon oxide type coatings deposited by PACVD for control of aquatic biofouling:
- 2008Electrical conductivity of liquid Sn-Ti-Zr alloyscitations
- 2007Pulsed epitaxial lateral overgrowth of GaN by metalorganic vapour phase epitaxy
- 2006Nano-composite single grain YBa2Cu3O 7-δ/Y2Ba4CuBiOy bulk superconductorscitations
- 2005Dynamic creep and mechanical characteristics of SmartSet GHV bone cementcitations
- 2004Roughness in GaN/InGaN films and multilayers determined with Rutherford backscatteringcitations
- 2003Selected techniques for examining the electrical, optical and spatial properties of extended defects in semiconductors
- 2002Depth profiling InGaN/GaN multiple quantum wells by Rutherford backscattering: the role of intermixingcitations
- 2002Structure and corrosion properties of PVD Cr-N coatingscitations
- 2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositioncitations
Places of action
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article
Under bump metallisation of fine pitch flip-chip using electroless nickel deposition
Abstract
For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the Al bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile Al pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the solder during reflow. The requirements of the UBM are therefore to provide a solder wettable surface and to protect the underlying Al bondpad during and after assembly. In addition, the UBM deposition process itself must remove any oxide layers on the bondpads to ensure a low resistance interface between the pad and the UBM. This paper reports an investigation of the electroless nickel deposition process for the under bump metallisation. of wafers that are subsequently to be bumped using solder paste printing. In particular this work has extended the process from previous trials on 225 mum pitch devices to wafers including die with sub 100 mum pitch bondpads. As part of this work, the effect of the various pre-treatment etching processes and zincate activation on the quality of the final electroless nickel bump has been investigated. The use of SEM examination of samples at each stage of the bumping process has been used to aid a detailed understanding of the activation mechanisms and to determine their effects on the electroless nickel bump morphology. In addition, shear testing of bumps has been used to determine the best pre-treatment regime to ensure good adhesion of the electroless nickel to the bondpad. Finally, electrical resistance measurements of bumped die have been used to confirm that the pre-treatment procedures are producing a low resistance interface between the Al and electroless nickel.