Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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VTT Technical Research Centre of Finland

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (4/4 displayed)

  • 2012Printed hybrid systems6citations
  • 2010Electrical Sintering of Conductor Grids for Optoelectronic Devicescitations
  • 2009Sintering of printed nanoparticle structures using laser treatmentcitations
  • 2003Application of NIR sensor modules for process measurementscitations

Places of action

Chart of shared publication
Alajoki, Teemu
1 / 4 shared
Hast, Jukka
1 / 6 shared
Korhonen, Raimo
1 / 1 shared
Hakalahti, Leena
1 / 5 shared
Keränen, Kimmo
1 / 14 shared
Masuda, Noriyuki
1 / 2 shared
Suhonen, Riikka
1 / 11 shared
Aikio, Janne
1 / 1 shared
Jaakola, Tuomo
1 / 4 shared
Mäkinen, Jukka-Tapani
1 / 6 shared
Karioja, Pentti
1 / 17 shared
Koponen, Matti
1 / 7 shared
Keränen, Antti
1 / 1 shared
Liedert, Ralph
1 / 1 shared
Rönkä, Kari
1 / 7 shared
Tuomikoski, Markus
1 / 7 shared
Kopola, Pälvi
1 / 4 shared
Heikkinen, Mikko
1 / 3 shared
Hiltunen, Jussi
1 / 24 shared
Mattila, Tomi
1 / 11 shared
Alastalo, Ari
1 / 22 shared
Seppä, Heikki
1 / 7 shared
Allen, Mark
1 / 3 shared
Leppäniemi, Jaakko
1 / 11 shared
Suhonen, Mika
1 / 3 shared
Mäntysalo, Matti
1 / 18 shared
Ruotsalainen, Saara
1 / 4 shared
Halonen, Eerik
1 / 1 shared
Laakso, Petri
1 / 14 shared
Känsäkoski, Markku
1 / 4 shared
Malinen, Jouko
1 / 1 shared
Hietala, Eero
1 / 2 shared
Chart of publication period
2012
2010
2009
2003

Co-Authors (by relevance)

  • Alajoki, Teemu
  • Hast, Jukka
  • Korhonen, Raimo
  • Hakalahti, Leena
  • Keränen, Kimmo
  • Masuda, Noriyuki
  • Suhonen, Riikka
  • Aikio, Janne
  • Jaakola, Tuomo
  • Mäkinen, Jukka-Tapani
  • Karioja, Pentti
  • Koponen, Matti
  • Keränen, Antti
  • Liedert, Ralph
  • Rönkä, Kari
  • Tuomikoski, Markus
  • Kopola, Pälvi
  • Heikkinen, Mikko
  • Hiltunen, Jussi
  • Mattila, Tomi
  • Alastalo, Ari
  • Seppä, Heikki
  • Allen, Mark
  • Leppäniemi, Jaakko
  • Suhonen, Mika
  • Mäntysalo, Matti
  • Ruotsalainen, Saara
  • Halonen, Eerik
  • Laakso, Petri
  • Känsäkoski, Markku
  • Malinen, Jouko
  • Hietala, Eero
OrganizationsLocationPeople

document

Printed hybrid systems

  • Alajoki, Teemu
  • Hast, Jukka
  • Korhonen, Raimo
  • Hakalahti, Leena
  • Keränen, Kimmo
  • Kemppainen, Antti
  • Masuda, Noriyuki
  • Suhonen, Riikka
  • Aikio, Janne
  • Jaakola, Tuomo
  • Mäkinen, Jukka-Tapani
  • Karioja, Pentti
  • Koponen, Matti
  • Keränen, Antti
  • Liedert, Ralph
  • Rönkä, Kari
  • Tuomikoski, Markus
  • Kopola, Pälvi
  • Heikkinen, Mikko
  • Hiltunen, Jussi
Abstract

This paper presents research activities carried out atVTT Technical Research Centre of Finland in the field ofhybrid integration of optics, electronics and mechanics.Main focus area in our research is the manufacturing ofelectronic modules and product structures with printedelectronics, film-over-molding and polymer sheetlamination technologies and the goal is in the nextgeneration of smart systems utilizing monolithic polymerpackages. The combination of manufacturing technologiessuch as roll-to-roll-printing, injection molding andtraditional component assembly is called Printed HybridSystems (PHS). Several demonstrator structures have beenmade, which show the potential of polymer packagingtechnology. One demonstrator example is a laminatedstructure with embedded LED chips. Element thickness isonly 0.3mm and the flexible stack of foils can be bent intwo directions after assembly process and was shapedcurved using heat and pressure. The combination ofprinted flexible circuit boards and injection molding hasalso been demonstrated with several functional modules.The demonstrators illustrate the potential of origamielectronics, which can be cut and folded to 3D shapes. Itshows that several manufacturing process steps can beeliminated by Printed Hybrid Systems technology. The mainbenefits of this combination are small size, ruggednessand conformality. The devices are ideally suited formedical applications as the sensitive electroniccomponents are well protected inside the plastic and thestructures can be cleaned easily due to the fact thatthey have no joints or seams that can accumulate dirt orbacteria

Topics
  • impedance spectroscopy
  • polymer
  • injection molding
  • sheet lamination