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| Kočí, Jan | Prague |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azevedo, Nuno Monteiro |
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Keränen, Kimmo
VTT Technical Research Centre of Finland
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2020The Effect of Torsional Bending on Reliability and Lifetime of Printed Silver Conductorscitations
- 2019Wireless Powering for Glass-Laminated Functionalities
- 2012Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanescitations
- 2012Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanescitations
- 2012Printed hybrid systemscitations
- 2012Hot laminated multilayer polymer illumination structure based in embedded LED chipscitations
- 2010Differential photoacoustic gas cell based on LTCC for ppm gas sensingcitations
- 2009Hermetic fiber pigtailed laser module utilizing passive device alignment on an LTCC substratecitations
- 2008Photonic module integration based on silicon, ceramic and plastic technologies
- 2007The studies of the illumination/detection module in Integrated Microinterferometric Extensometer
- 2007Inmould integration of a microscope add-on system to a 1.3 Mpix camera phonecitations
- 2006Fiber pigtailed multimode laser module based on passive device alignment on an LTCC substratecitations
- 2006Cost-efficient hermetic fibre pigtailed laser module utilizing passive device alignment on an LTCC substrate
- 2002Fiberoptic in-vessel viewing system for the international thermonuclear experimental reactorcitations
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document
Printed hybrid systems
Abstract
This paper presents research activities carried out atVTT Technical Research Centre of Finland in the field ofhybrid integration of optics, electronics and mechanics.Main focus area in our research is the manufacturing ofelectronic modules and product structures with printedelectronics, film-over-molding and polymer sheetlamination technologies and the goal is in the nextgeneration of smart systems utilizing monolithic polymerpackages. The combination of manufacturing technologiessuch as roll-to-roll-printing, injection molding andtraditional component assembly is called Printed HybridSystems (PHS). Several demonstrator structures have beenmade, which show the potential of polymer packagingtechnology. One demonstrator example is a laminatedstructure with embedded LED chips. Element thickness isonly 0.3mm and the flexible stack of foils can be bent intwo directions after assembly process and was shapedcurved using heat and pressure. The combination ofprinted flexible circuit boards and injection molding hasalso been demonstrated with several functional modules.The demonstrators illustrate the potential of origamielectronics, which can be cut and folded to 3D shapes. Itshows that several manufacturing process steps can beeliminated by Printed Hybrid Systems technology. The mainbenefits of this combination are small size, ruggednessand conformality. The devices are ideally suited formedical applications as the sensitive electroniccomponents are well protected inside the plastic and thestructures can be cleaned easily due to the fact thatthey have no joints or seams that can accumulate dirt orbacteria