Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Lahti, Markku

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VTT Technical Research Centre of Finland

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (8/8 displayed)

  • 2024Cryogenic characterization of LTCC material in Millimeter-Wave Frequencies2citations
  • 2018Reliability assessment and failure mode analysis of MEMS accelerometers for space applications15citations
  • 2012Hot laminated multilayer polymer illumination structure based in embedded LED chips7citations
  • 2011Investigation of substrate integrated waveguide in LTCC technology for mm-wave applicationscitations
  • 2011System-in-package LTCC platform for 3D RF to millimeter wave1citations
  • 2010Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technologycitations
  • 2007Mixed LTCC ultra compact S-band filters with wide multispurious stopband1citations
  • 2006Integrated LTCC modules by laminating and co-firing tapes directly on heat sink1citations

Places of action

Chart of shared publication
Kaunisto, Mikko
1 / 1 shared
Martinez-Ledesma, Miguel
1 / 1 shared
Varonen, Mikko
1 / 1 shared
Paaso, Jaska
1 / 1 shared
Rodriguez, Rafael
1 / 4 shared
Reeves, Rodrigo
1 / 1 shared
Vargas-Millalonco, Felipe
1 / 1 shared
Marozau, I.
1 / 9 shared
Pejchal, V.
1 / 4 shared
Saillen, N.
1 / 1 shared
Sereda, O.
1 / 1 shared
Souchon, F.
1 / 1 shared
Vogel, D.
1 / 13 shared
Auchlin, M.
1 / 1 shared
Keränen, Kimmo
1 / 14 shared
Rönkä, Kari
1 / 7 shared
Sunnari, Antti
1 / 1 shared
Mäkinen, Jukka-Tapani
1 / 6 shared
Hiltunen, Marianne
1 / 6 shared
Heikkinen, Mikko
1 / 3 shared
Koponen, Matti
1 / 7 shared
Stefanescu, A.
1 / 1 shared
Bunea, A.-C.
1 / 1 shared
Vähä-Heikkilä, Tauno
3 / 6 shared
Neculoiu, D.
1 / 1 shared
Baggen, R.
1 / 1 shared
Lahdes, Manu
1 / 2 shared
Malmqvist, C.
1 / 1 shared
Rantakari, Pekka
1 / 1 shared
Samuelsson, C.
1 / 1 shared
Simon, W.
1 / 1 shared
Varis, Jussi
1 / 1 shared
Smith, D.
1 / 13 shared
Baillargeat, Dominique
1 / 22 shared
Verdeyme, Serge
1 / 5 shared
Rigaudeau, Laetitia
1 / 1 shared
Kautio, Kari
2 / 10 shared
Karioja, Pentti
1 / 17 shared
Chart of publication period
2024
2018
2012
2011
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2007
2006

Co-Authors (by relevance)

  • Kaunisto, Mikko
  • Martinez-Ledesma, Miguel
  • Varonen, Mikko
  • Paaso, Jaska
  • Rodriguez, Rafael
  • Reeves, Rodrigo
  • Vargas-Millalonco, Felipe
  • Marozau, I.
  • Pejchal, V.
  • Saillen, N.
  • Sereda, O.
  • Souchon, F.
  • Vogel, D.
  • Auchlin, M.
  • Keränen, Kimmo
  • Rönkä, Kari
  • Sunnari, Antti
  • Mäkinen, Jukka-Tapani
  • Hiltunen, Marianne
  • Heikkinen, Mikko
  • Koponen, Matti
  • Stefanescu, A.
  • Bunea, A.-C.
  • Vähä-Heikkilä, Tauno
  • Neculoiu, D.
  • Baggen, R.
  • Lahdes, Manu
  • Malmqvist, C.
  • Rantakari, Pekka
  • Samuelsson, C.
  • Simon, W.
  • Varis, Jussi
  • Smith, D.
  • Baillargeat, Dominique
  • Verdeyme, Serge
  • Rigaudeau, Laetitia
  • Kautio, Kari
  • Karioja, Pentti
OrganizationsLocationPeople

document

System-in-package LTCC platform for 3D RF to millimeter wave

  • Lahti, Markku
  • Vähä-Heikkilä, Tauno
Abstract

This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves. The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications. Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays

Topics
  • impedance spectroscopy
  • ceramic
  • wire